Electronic device and method of manufacturing electronic device

A method of manufacturing an electronic device, comprising:

• providing a glass substrate, wherein the glass substrate comprises a first surface and a second surface corresponding to the first surface;
• patterning the glass substrate to form at least two first through holes, wherein a third surface is formed in the glass substrate by the first through hole, and the third surface is connected to the first surface and the second surface;
• forming a first conductive layer on the first surface;
• forming a second conductive layer on the second surface;
• and
• forming a third conductive layer on the third surface, such that the third conductive layer is electrically connected to the first conductive layer and the second conductive layer,
• wherein the first through hole has a major axis and a minor axis in a top view direction,
• wherein the method further comprises:
• providing another substrate;
• forming a first adhesive layer on the another substrate;
• cutting the glass substrate to form a plurality of subunits;
• and
• bonding the plurality of subunits to the another substrate through the first adhesive layer.