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US 12,604,743 B2Granted
Method for making a recess or opening into a planar workpiece using successive etching
AssigneeLpkf Laser & Electronics AG
InventorsNorbert Ambrosius, Roman Ostholt
Life of this patent
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Abstract
A method for making a recess or opening in a planar workpiece with a thickness of less than 3 millimeters includes successively etching a plurality of flaws to form the recess or opening such that a contour of the recess or opening has a sequence of widenings and constrictions as a result of the etching.
Claims20
A method for making a recess or opening in a planar workpiece with a thickness of less than 3 millimeters, the method comprising:
- successively etching a plurality of flaws to form the recess or opening having a diameter and a cross-section, such that the cross-section of the recess or opening has a sequence of widenings and constrictions of the diameter as a result of the etching,
- wherein the widenings, as viewed in the cross-section, have different concave arcuate shapes between adjacent ones of the constrictions.
Dependencies are inferred from the claim text.