Package having thick glass core with high aspect ratio vias
AssigneeIntel Corporation
InventorTelesphor Kamgaing
Life of this patent
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Abstract
Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section. The package substrate may further comprise a second glass layer over the first glass layer, where the second glass layer comprises a second via through the second glass layer, and where the second via has the hourglass shaped cross-section. In an embodiment, the first via is electrically coupled to the second via.
Claims12
A package substrate, comprising:
- a first glass layer, wherein the first glass layer comprises a first via through the first glass layer, and wherein the first via has a first hourglass shaped cross-section;
- and
- a second glass layer over and in direct contact with the first glass layer, wherein the second glass layer comprises a second via through the second glass layer, wherein the second via has a second hourglass shaped cross-section, wherein the first via is electrically coupled to the second via, wherein a widest portion of the second via is in direct physical contact with a widest portion of the first via, wherein the widest portion of the second via has a bottommost surface at a same level as a bottommost surface of the second glass layer, and wherein the first via has an uppermost surface at a same level as an uppermost surface of the first glass layer.
A method of forming a package substrate, comprising:
- forming first vias through a first glass layer, wherein the first vias are formed by exposing the first glass layer to a laser, etching exposed portions of the first glass layer to form holes, and depositing a via material in the holes;
- forming second vias through a second glass layer, wherein the second vias are formed by exposing the second glass layer to the laser, etching exposed portions of the second glass layer to form holes, and depositing a via material in the holes;
- and
- securing the first glass layer to the second glass layer such that the first glass layer is in direct contact with the second glass layer, wherein the first vias are electrically coupled to the second vias, wherein the first vias and the second vias comprise an hourglass shaped cross-section, wherein a widest portion of each of the second vias is in direct physical contact with a widest portion of a corresponding one of the first vias, wherein the widest portion of each of the second vias has a bottommost surface at a same level as a bottommost surface of the second glass layer, and wherein each of the first vias has an uppermost surface at a same level as an uppermost surface of the first glass layer.
An electronic system, comprising:
- a board;
- a package substrate coupled to the board, wherein the package substrate comprises:
- a core substrate with a plurality of glass layers and a plurality of vias through the plurality of glass layers, wherein the plurality of glass layers are in direct contact with each other, wherein the plurality of vias each have an hourglass shaped cross-section, wherein a widest portion of each of the vias of a first glass layer of the plurality of glass layers is in direct physical contact with a widest portion of a corresponding one of the vias of a second glass layer of the plurality of glass layers, wherein the widest portion of each of the vias of the second glass layer has a bottommost surface at a same level as a bottommost surface of the second glass layer, and wherein each of the vias of the first glass layer has an uppermost surface at a same level as an uppermost surface of the first glass layer;
- and
- a buildup layer over the core substrate;
- and
- a die coupled to the package substrate.
Dependencies are inferred from the claim text.