H05K 3/002
By liquid chemical etching
Official title: {by liquid chemical etching}
H05K3/002 (By liquid chemical etching) appears on 329 US grants and 324 published applications in this corpus.
Search patents in H05K- Granted patents
- 329
- Published applications
- 324
- Assignees
- 190
- Inventors
- 905
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 9 | 0 |
| 1991 | 2 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 3 |
| 2002 | 7 | 14 |
| 2003 | 10 | 8 |
| 2004 | 8 | 22 |
| 2005 | 10 | 15 |
| 2006 | 11 | 15 |
| 2007 | 10 | 24 |
| 2008 | 9 | 13 |
| 2009 | 5 | 9 |
| 2010 | 9 | 14 |
| 2011 | 6 | 7 |
| 2012 | 12 | 10 |
| 2013 | 6 | 10 |
| 2014 | 11 | 12 |
| 2015 | 9 | 17 |
| 2016 | 13 | 14 |
| 2017 | 14 | 15 |
| 2018 | 11 | 17 |
| 2019 | 19 | 13 |
| 2020 | 6 | 12 |
| 2021 | 10 | 12 |
| 2022 | 7 | 15 |
| 2023 | 9 | 5 |
| 2024 | 8 | 16 |
| 2025 | 8 | 6 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Electronic device including outer housing plated with conductive member and manufacturing method therefor3 Feb 2026US 12,540,402 B2Intops Co., Ltd.
- Multilayer substrate and method for manufacturing multilayer substrate18 Nov 2025US 12,477,648 B2Murata Manufacturing Co., Ltd.
- Wiring board manufacturing method and wiring board4 Nov 2025US 12,463,056 B2Toppan Inc.
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper7 Oct 2025US 12,439,528 B2Atotech Deutschland GmbH
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Method and system for manufacturing electrical interface comprising array of thin pins2 Jul 2026US 2026/0190240 A1CompTake Technology Inc.
- Laminated substrate and method for manufacturing the same28 May 2026US 2026/0150196 A1Monolithic Power Systems, Inc.
- Glass wafer and method for producing same30 Apr 2026US 2026/0122781 A1Schott AG
- Method of manufacturing circuit board23 Apr 2026US 2026/0113852 A1Alps Alpine Co., Ltd.
Most cited
By later US patents
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Forming via holes in a multilevel substrate in a single step139US 5,227,013 AMicroelectronics and Computer Technology Corporation · 1993
- Multilayer circuit board fabrication process119US 4,915,983 AThe Foxboro Company · 1990
- Method for producing laminated film/metal structures for known good die ("KG") applications119US 5,776,824 AMicron Technology, Inc. · 1998
- Flexible film semiconductor chip carrier93US 4,681,654 AInternational Business Machines Corporation · 1987