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US 12,477,648 B2Granted
Multilayer substrate and method for manufacturing multilayer substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorKosuke Nishio
Life of this patent
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Abstract
A multilayer substrate includes laminated insulating layers each including a main surface on which a conductor is provided. The multilayer substrate also includes a signal line defined by the conductors, and a shield conductor defined by the conductors. The shield conductor includes an opening and a portion overlapping the signal line in plan view. At least one of the insulating layers includes a void that communicates with the opening and that is larger than the opening in plan view.
Claims9
A multilayer substrate comprising:
- a laminated substrate including a plurality of laminated insulating layers, and a plurality of conductors each provided on a main surface of at least some of the plurality of insulating layers;
- a signal line defined by one of the plurality of conductors;
- and
- a shield conductor defined by another one of the plurality of conductors, the shield conductor including a portion overlapping the signal line in plan view;
- wherein
- the shield conductor includes an opening;
- at least one of the plurality of insulating layers includes a void that communicates with the opening and that is larger than the opening in plan view;
- and
- at least a portion of the laminated insulating layers is located between the signal line and the portion of the shield conductor overlapping the signal line in a lamination direction;
- and
- a portion of the void overlaps the signal line and the shield conductor in the lamination direction.
8 more elements
Dependencies are inferred from the claim text.