Electronic device including outer housing plated with conductive member and manufacturing method therefor

A method of manufacturing an electronic device, the method comprising:

• forming a first trench in a first plating area of a first surface of an outer housing at least partially forming an exterior of the electronic device, the first surface being exposed to the outside;
• forming, in a plating area, a first plating layer comprising a first metallic material, the plating area comprising at least one of the first plating area, a second plating area, and a third plating area;
• polishing the first plating area;
• and
• forming a coating layer on the first surface of the outer housing.

A case of an electronic device, comprising:

• an outer housing;
• a trench comprising:
• a valley that is concave with respect to a surface of the outer housing;
• and
• a peak that is convex with respect to the surface of the outer housing and has a partially removed end;
• a first conductive member;
• and
• a coating layer laminated on the outer housing and disposed on the first conductive member,
• wherein the trench is plated with the first conductive member.