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AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, David R. Hembree
Estimating the term…
A process for producing laminated film/metal structures comprising bumped circuit traces on a non-conductive substrate wherein a copper sheet/polyimide film laminate is coated with resist on the exterior surfaces. The resist adjacent the polyimide film is selectively exposed and etched to expose an area of the polyimide film. The exposed polyimide film is etched to form vias through the polyimide film to the inner side of the copper sheet. The resist adjacent the polyimide film is stripped away and a metal bump is electrolytically plated through each via onto the copper sheet. A subsequent layer of resist is electrophoretically applied over the bumps. The resist material adjacent the copper sheet is then selectively exposed and etched to expose areas of the copper sheet. The exposed copper sheet is etched to form circuit traces and the remaining resist adjacent both the polyimide film and the copper sheet is stripped away.
A method of producing a substrate, said substrate including a plurality of circuit traces laminated to a nonconductive film and including conductive contact bumps for making contact with bond pads of a semiconductor die, said contact bumps in electrical contact with said circuit traces through said film and protruding above said film on the opposite side thereof from said circuit traces, comprising:
A process for producing a structure including a circuit trace laminated to a nonconductive film and including at least one contact bump in electrical contact with said circuit trace through said film, comprising:
A process for producing a structure including a circuit trace laminated to a nonconductive film and including at least one contact bump in electrical contact with said circuit trace through said film, comprising:
Dependencies are inferred from the claim text.