H05K 3/0023
By exposure and development of a photosensitive insulating layer
Official title: {by exposure and development of a photosensitive insulating layer}
H05K3/0023 (By exposure and development of a photosensitive insulating layer) appears on 605 US grants and 417 published applications in this corpus.
Search patents in H05K- Granted patents
- 605
- Published applications
- 417
- Assignees
- 240
- Inventors
- 1,187
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 4 | 0 |
| 1986 | 9 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 14 | 0 |
| 1991 | 8 | 0 |
| 1992 | 12 | 0 |
| 1993 | 17 | 0 |
| 1994 | 20 | 0 |
| 1995 | 12 | 0 |
| 1996 | 17 | 0 |
| 1997 | 15 | 0 |
| 1998 | 21 | 0 |
| 1999 | 24 | 0 |
| 2000 | 27 | 0 |
| 2001 | 30 | 18 |
| 2002 | 29 | 27 |
| 2003 | 37 | 23 |
| 2004 | 37 | 27 |
| 2005 | 10 | 32 |
| 2006 | 15 | 33 |
| 2007 | 12 | 33 |
| 2008 | 19 | 20 |
| 2009 | 14 | 25 |
| 2010 | 10 | 14 |
| 2011 | 19 | 11 |
| 2012 | 18 | 3 |
| 2013 | 7 | 7 |
| 2014 | 5 | 5 |
| 2015 | 5 | 11 |
| 2016 | 7 | 15 |
| 2017 | 9 | 21 |
| 2018 | 17 | 13 |
| 2019 | 16 | 16 |
| 2020 | 14 | 12 |
| 2021 | 11 | 9 |
| 2022 | 6 | 13 |
| 2023 | 8 | 10 |
| 2024 | 9 | 8 |
| 2025 | 7 | 9 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package substrate and manufacturing method thereof26 May 2026US 12,641,729 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board21 Apr 2026US 12,606,662 B2Resonac Corporation
- Silicon flexible connectors9 Dec 2025US 12,494,599 B2Northrop Grumman Systems Corporation
- Method of manufacturing conductive pattern, touch sensor, electromagnetic wave shield, antenna, wiring board, conductive heating element, and structure23 Sep 2025US 12,426,166 B2FUJIFILM Corporation
- Method for manufacturing flexible printed circuit board17 Jun 2025US 12,336,091 B2LG Energy Solution, Ltd.
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Method for manufacturing master mold for imprinting29 Jan 2026US 2026/0027751 A1CONNECTEC JAPAN Corporation
- Method for manufacturing electronic device and electronic device prepared by using the same2 Oct 2025US 2025/0309102 A1Innolux Corporation
- Method for manufacturing wiring substrate2 Oct 2025US 2025/0311111 A1Ibiden Co., Ltd.
- Method for manufacturing flexible printed circuit board21 Aug 2025US 2025/0267787 A1LG Energy Solution, Ltd.
Most cited
By later US patents
- Formulation of multichip modules293US 5,239,448 AInternational Business Machines Corporation · 1993
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993