Method of manufacturing conductive pattern, touch sensor, electromagnetic wave shield, antenna, wiring board, conductive heating element, and structure

A method of manufacturing a conductive pattern, the method comprising:

• preparing a laminate including a transparent substrate, a light shielding pattern that is formed on the transparent substrate, and a negative tone photosensitive resin layer that is disposed on the transparent substrate and the light shielding pattern and is in contact with the transparent substrate;
• irradiating a surface of the transparent substrate opposite to a surface facing the light shielding pattern with light;
• developing the negative tone photosensitive resin layer to form a resin pattern having an average thickness of 10 μm or more in a region defined by the transparent substrate and the light shielding pattern;
• and
• forming a conductive pattern on the light shielding pattern, wherein:
• the preparing the laminate includes forming the negative tone photosensitive resin layer on the transparent substrate and the light shielding pattern, in a laminate precursor including the transparent substrate and the light shielding pattern that is formed on the transparent substrate, using a photosensitive transfer material including the negative tone photosensitive resin layer and a temporary support having an average thickness of 5 μm to 50 μm;
• the negative tone photosensitive resin layer includes an alkali-soluble polymer, a compound having an ethylenically unsaturated bond, a photopolymerization initiator, a sensitizer, and a chain transfer agent;
• the compound having an ethylenically unsaturated bond includes a bifunctional ethylenically unsaturated compound having a bisphenol A structure;
• and
• the photopolymerization initiator includes at least one selected from the group consisting of 2,4,5-triarylimidazole dimer and a derivative of 2,4,5-triarylimidazole dimer.