Package substrate and manufacturing method thereof

A method for manufacturing a package substrate, comprising:

• providing an inner substrate;
• processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer;
• mounting a component on the first insulating dielectric layer;
• and
• processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, wherein the second insulating dielectric layer covers the component;
• wherein a circuit layer is provided on the first side of the inner substrate, at least one connection point is provided on the circuit layer;
• machining the first blind hole in the second insulating dielectric layer, and machining a second blind hole in the first insulating dielectric layer and the second insulating dielectric layer by means of exposure and development;
• wherein a position of the first blind hole corresponds to a position of a connection terminal of the component, a position of the second blind hole corresponds to a position of the connection point of the circuit layer, the first blind hole extends across the second insulating dielectric layer, and the second blind hole extends across both the first insulating dielectric layer and the second insulating dielectric layer.