H05K 3/22
Secondary treatment of printed circuits
Official title: Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)}
H05K3/22 (Secondary treatment of printed circuits) appears on 10,789 US grants and 10,296 published applications in this corpus.
Search patents in H05K- Granted patents
- 10,789
- Published applications
- 10,296
- Assignees
- 3,212
- Inventors
- 22,011
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 41 | 0 |
| 1977 | 36 | 0 |
| 1978 | 46 | 0 |
| 1979 | 24 | 0 |
| 1980 | 42 | 0 |
| 1981 | 60 | 0 |
| 1982 | 49 | 0 |
| 1983 | 68 | 0 |
| 1984 | 76 | 0 |
| 1985 | 91 | 0 |
| 1986 | 81 | 0 |
| 1987 | 107 | 0 |
| 1988 | 107 | 0 |
| 1989 | 112 | 0 |
| 1990 | 130 | 0 |
| 1991 | 175 | 0 |
| 1992 | 165 | 0 |
| 1993 | 192 | 0 |
| 1994 | 191 | 0 |
| 1995 | 188 | 0 |
| 1996 | 162 | 0 |
| 1997 | 167 | 0 |
| 1998 | 253 | 0 |
| 1999 | 224 | 0 |
| 2000 | 214 | 0 |
| 2001 | 257 | 115 |
| 2002 | 281 | 312 |
| 2003 | 317 | 369 |
| 2004 | 307 | 453 |
| 2005 | 264 | 495 |
| 2006 | 260 | 487 |
| 2007 | 265 | 529 |
| 2008 | 284 | 516 |
| 2009 | 270 | 584 |
| 2010 | 301 | 501 |
| 2011 | 351 | 364 |
| 2012 | 379 | 323 |
| 2013 | 270 | 307 |
| 2014 | 269 | 403 |
| 2015 | 274 | 459 |
| 2016 | 328 | 372 |
| 2017 | 363 | 405 |
| 2018 | 347 | 402 |
| 2019 | 422 | 409 |
| 2020 | 383 | 444 |
| 2021 | 337 | 399 |
| 2022 | 312 | 351 |
| 2023 | 255 | 349 |
| 2024 | 268 | 345 |
| 2025 | 281 | 276 |
| 2026 | 143 | 327 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/28Applying non-metallic protective coatings6,189
- H05K 3/24Reinforcing of the conductive pattern3,039
- H05K 3/26Cleaning or polishing of the conductive pattern642
- H05K 3/225Correcting or repairing of printed circuits512
- H05K 3/222Completing of printed circuits by adding non-printed jumper connections473
- H05K 3/227Drying of printed circuits136
Recent patents
- Biphasic material and stretchable circuit board6 Oct 2026US 12,757,321 B2Yale University
- Electronic device and manufacturing method thereof6 Oct 2026US 12,757,323 B2Innolux Corporation
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Package structure29 Sep 2026US 12,750,978 B2TMY Technology Inc.
- Module including metal member with protruding portion and method for manufacturing module29 Sep 2026US 12,750,992 B2Murata Manufacturing Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Circuit board assembly and method of manufacturing display using the same8 Oct 2026US 2026/0313812 A1Samsung Display Co., Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Memory device with emi shield1 Oct 2026US 2026/0304600 A1Micron Technology, Inc.
Most cited
By later US patents
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Compact convection drying chamber for drying printed circuit boards and other electronic assemblies by enhanced evaporation550US 6,760,981 B2Speedline Technologies, Inc. · 2004
- Fold flex circuit for LNOP540US 10,327,337 B2Masimo Corporation · 2019
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- Alumina insulation for coating implantable components and other microminiature devices490US 6,043,437 AAlfred E. Mann Foundation · 2000