H05K 3/225
Correcting or repairing of printed circuits
Official title: {Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence)}
H05K3/225 (Correcting or repairing of printed circuits) appears on 512 US grants and 416 published applications in this corpus.
Search patents in H05K- Granted patents
- 512
- Published applications
- 416
- Assignees
- 287
- Inventors
- 1,289
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 3 | 0 |
| 1985 | 9 | 0 |
| 1986 | 4 | 0 |
| 1987 | 9 | 0 |
| 1988 | 9 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 12 | 0 |
| 1992 | 17 | 0 |
| 1993 | 11 | 0 |
| 1994 | 18 | 0 |
| 1995 | 12 | 0 |
| 1996 | 9 | 0 |
| 1997 | 6 | 0 |
| 1998 | 12 | 0 |
| 1999 | 16 | 0 |
| 2000 | 21 | 0 |
| 2001 | 11 | 5 |
| 2002 | 18 | 18 |
| 2003 | 18 | 25 |
| 2004 | 15 | 26 |
| 2005 | 15 | 19 |
| 2006 | 15 | 14 |
| 2007 | 15 | 28 |
| 2008 | 12 | 16 |
| 2009 | 15 | 25 |
| 2010 | 11 | 14 |
| 2011 | 10 | 14 |
| 2012 | 12 | 16 |
| 2013 | 9 | 11 |
| 2014 | 17 | 25 |
| 2015 | 13 | 14 |
| 2016 | 16 | 18 |
| 2017 | 9 | 11 |
| 2018 | 12 | 10 |
| 2019 | 10 | 11 |
| 2020 | 15 | 14 |
| 2021 | 8 | 12 |
| 2022 | 13 | 16 |
| 2023 | 6 | 6 |
| 2024 | 7 | 22 |
| 2025 | 9 | 13 |
| 2026 | 8 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Printed circuit board, maintenance method therefor, and display apparatus28 Jul 2026US 12,696,388 B2Boe Technology Group Co., Ltd.
- Filling cracks on a substrate via24 Mar 2026US 12,588,147 B2Micron Technology, Inc.
- Rework patch for an electronic circuit10 Mar 2026US 12,575,034 B2Jabil Inc.
- Electronic device17 Feb 2026US 12,557,435 B2Innolux Corporation
- Straddle-mount connector rework27 Aug 2026US 2026/0255496 A1International Business Machines Corporation
- Method for manufacturing circuit board, apparatus for packaging circuit board, and electronic apparatus27 Aug 2026US 2026/0255497 A1Samsung Display Co., Ltd.
- Component isolation during plasma exposure6 Aug 2026US 2026/0231340 A1Skyworks Solutions, Inc.
- Electronic device23 Jul 2026US 2026/0214796 A1AUO Corporation
- Hot air liquid conductive cooling (halcc) device16 Jul 2026US 2026/0206146 A1Flex Ltd.
Most cited
By later US patents
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Interconnect adapter and head suspension assembly185US 6,025,988 ARead-Rite Corporation · 2000
- Thermally assisted shorts removal process for glass ceramic product using an RF field149US 5,290,986 AInternational Business Machines Corporation · 1994
- Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate139US 5,278,012 AHitachi, Ltd. · 1994
- Electric circuits having repairable circuit lines and method of making the same127US 4,630,355 AEnergy Conversion Devices, Inc. · 1986