Orbotech Ltd.
Yavne, IL· latest recorded location
Orbotech Ltd. is named on 167 US grants and 126 published applications in this corpus. Its most frequent classification is G01N (Investigating or analysing materials by determining their chemical or physical properties).
- Granted patents
- 167
- Published applications
- 126
- Inventors
- 221
- Granted in 2026 so far
- 14
- Most recent grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 6 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 2 |
| 2002 | 3 | 3 |
| 2003 | 5 | 4 |
| 2004 | 13 | 1 |
| 2005 | 6 | 1 |
| 2006 | 10 | 2 |
| 2007 | 14 | 7 |
| 2008 | 7 | 6 |
| 2009 | 7 | 2 |
| 2010 | 4 | 5 |
| 2011 | 7 | 7 |
| 2012 | 5 | 2 |
| 2013 | 6 | 5 |
| 2014 | 3 | 1 |
| 2015 | 1 | 5 |
| 2016 | 4 | 3 |
| 2017 | 1 | 8 |
| 2018 | 2 | 4 |
| 2019 | 6 | 4 |
| 2020 | 5 | 1 |
| 2021 | 2 | 5 |
| 2022 | 4 | 7 |
| 2023 | 4 | 5 |
| 2024 | 8 | 17 |
| 2025 | 9 | 11 |
| 2026 | 14 | 8 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 293 documents
- G01NInvestigating or analysing materials by determining their chemical or physical properties81
- H05KPrinted circuits72
- B23KSoldering or unsoldering44
- G02BOptical elements, systems or apparatus44
- G03FPhotomechanical production of textured or patterned surfaces42
- G02FOptical devices or arrangements for the control of light by modification of35
- H04NPictorial communication35
- G06TImage data processing or generation, in general34
- G01RMeasuring electric variables31
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered21
Recent patents
- Automatic optical inspection using hybrid imaging system6 Oct 2026US 12,755,370 B2
- Repair of solder bumps29 Sep 2026US 12,746,613 B2
- In-situ wafer stress measurement by chromatic confocal sensor scanning with temperature compensation25 Aug 2026US 12,716,713 B2
- VIOS modulator sensitivity for micro LED backplane array electrical test25 Aug 2026US 12,721,108 B2
- In-situ wafer stress measurement by chromatic confocal sensor scanning with vibration compensation18 Aug 2026US 12,710,265 B2
- Systems and methods for laser processing and optical inspection1 Oct 2026US 2026/0295719 A1
- System and method for inspection and metrology of three-dimensional features1 Oct 2026US 2026/0298619 A1
- System and method for transparent layer compensation in 3d optical metrology24 Sep 2026US 2026/0287334 A1
- Vertically aligned liquid crystal modulator for voltage image display inspection2 Jul 2026US 2026/0186347 A1
- Liquid crystal modulator design using hybrid alignment technique2 Jul 2026US 2026/0186348 A1
Most cited
By later US patents