Rework patch for an electronic circuit
AssigneeJabil Inc.
InventorsMuhammad Irsyad Bin Suhaimi, Lai Ming Lim, Zambri Samsudin
Life of this patent
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Abstract
A rework patch for an electronic circuit includes a flexible patch body and at least two patch traces. The electronic circuit includes a substrate, at least two board traces formed on the substrate, and at least one defect portion within at least one of the board traces. The patch body is attached to the substrate to partially cover each of the board traces and to cover the defect portion. The patch traces are formed on the patch body. A pattern of the patch traces corresponds to a pattern of a portion of the board traces covered by the patch body.
Claims15
A rework patch adapted for a rework process of an electronic circuit, the electronic circuit including a substrate, at least two spaced-apart board traces that are formed on the substrate, and at least one defect portion within at least one of the board traces, said rework patch comprising:
- a flexible patch body adapted to be attached to the substrate to partially cover each of the board traces and to cover the defect portion;
- and
- at least two spaced-apart patch traces formed on said patch body, a pattern of said patch traces corresponding to a pattern of a portion of the board traces covered by said patch body, said patch traces being formed at one side of said patch body opposite to the substrate in direct connection with an electronic component,
- wherein said patch body is made of one of an ultraviolet (UV) acrylic hotmelt adhesive, flexible and/or stretchable Polydimethylsiloxane (PDMs), Silicon, and urethane based substrate.
A method for a rework process of an electronic circuit, the electronic circuit including a substrate, at least two spaced-apart board traces that are formed on the substrate, and at least one defect portion within at least one of the board traces, the method comprising steps of:
- a) laminating a rework patch on to the substrate to partially cover each of the board traces and to cover the defect portion, wherein the rework patch includes:
- a flexible patch body adapted to be attached to the substrate to partially cover each of the board traces and to cover the defect portion;
- and
- at least two spaced-apart patch traces formed on said patch body, a pattern of said patch traces corresponding to a pattern of a portion of the board traces covered by said patch body, said patch traces being formed at one side of said patch body opposite to the substrate, wherein said patch body is made of one of an ultraviolet (UV) acrylic hotmelt adhesive, flexible and/or stretchable Polydimethylsiloxane (PDMs), Silicon, and urethane based substrate;
- b) dispensing a plurality of conductive lumps on a periphery of the patch body to establish an electrical connection between each of the patch traces and a respective one of the board traces;
- and
- c) forming an electrical connection between an electronic component and each of the patch traces.
A method for a rework process of an electronic circuit, the electronic circuit including a substrate, at least two spaced-apart board traces that are formed on the substrate, and at least one defect portion within at least one of the board traces, the method comprising steps of:
- e) laminating a rework patch on to the substrate to partially cover each of the board traces and to cover the defect portion, wherein the rework patch includes:
- a flexible patch body adapted to be attached to the substrate to partially cover each of the board traces and to cover the defect portion;
- and
- at least two spaced-apart patch traces formed on said patch body, a pattern of said patch traces corresponding to a pattern of a portion of the board traces covered by said patch body, said patch traces being formed at one side of said patch body opposite to the substrate, wherein said patch body is made of one of an ultraviolet (UV) acrylic hotmelt adhesive, flexible and/or stretchable Polydimethylsiloxane (PDMs), Silicon, and urethane based substrate;
- f) dispensing a non-conductive adhesive (NCA) on the rework patch to partially cover the patch traces;
- g) mounting an electronic component to the non-conductive adhesive to be firmly held by the non-conductive adhesive;
- and
- h) dispensing a plurality of conductive lumps on the non-conductive adhesive to establish an electrical connection between a replacement electronic component and each of the board traces.
A rework patch adapted for a rework process of an electronic circuit, the electronic circuit including a substrate, at least two spaced-apart board traces that are formed on the substrate, and at least one defect portion within at least one of the board traces, said rework patch comprising:
- a flexible patch body adapted to be attached to the substrate to partially cover each of the board traces and to cover the defect portion, said patch body being made of a non-conductive material;
- and
- at least two spaced-apart patch traces formed on said patch body, a pattern of said patch traces corresponding to a pattern of a portion of the board traces covered by said patch body, said patch traces being formed at one side of said patch body opposite to the substrate in direct connection with an electronic component,
- wherein said patch body is made of one of an ultraviolet (UV) acrylic hotmelt adhesive, flexible and/or stretchable Polydimethylsiloxane (PDMs), Silicon, and urethane based substrate.
Dependencies are inferred from the claim text.