Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate

A method of producing a thin film multilayer substrate, having a base substrate, a plurality of circuit conductor pattern layers superposed thereon and dielectric layers, each of the dielectric layers being interposed between portions of adjacent conductor pattern layers, by depositing layer on layer, comprising the steps of:

• detecting a pattern of one of said conductor pattern layers at a time when said one of said conductor pattern layers has been newly formed at least on said base substrate and before depositing the dielectric layer thereon;
• inspecting for an absence or presence of a faulty portion in said one of said conductor pattern layers and determining a position of the faulty portion upon inspection of the presence of the faulty portion;
• repairing the faulty portion in said one of said conductor pattern layers in accordance with data of the determined position of the faulty portion;
• and
• subsequently depositing the dielectric layer and a further one of said conductor pattern layers on the repaired one of said conductor pattern layers;
• wherein the step of detecting a pattern comprises optically detecting the pattern by projecting one of a visible and ultraviolet light having a wavelength region so that a detected intensity of light reflected from said one of said conductor pattern layers is different from a detected intensity of light reflected from an exposed dielectric layer,
• wherein the step of optically detecting the pattern of said one of said conductor pattern layers includes projecting light on said one of said conductor pattern layers and an exposed surface of the dielectric layer from multiple directions, and detecting the reflected light from said one of said conductor pattern layers.

A method for producing a thin film multilayer substrate structure, comprising the steps of:

• (a) producing a first thin film multilayer substrate including
• (i) forming a first thin film conductor pattern layer on a substrate,
• (ii) forming a first insulating layer having a first through-hole for electrical connection on the first thin film conductor pattern layer, and
• (iii) forming a second thin film conductor pattern layer having a flat portion and an inclined portion on the first insulating layer and which is electrically connected with the first thin film conductor pattern layer through the first through-hole;
• (b) projecting light onto a surface of the first thin film multilayer substrate from light projection means at least in directions oblique relative to a principal surface of the first thin film multilayer substrate and from a circumference thereof so as to effect scanning relative thereto in two directions so that an intensity of light reflected by a surface of the inclined portion of the second thin film conductor pattern layer is substantially the same as an intensity of light reflected by a surface of the flat portion of the second thin film conductor pattern layer and so that each of intensities of light reflected by the first thin film conductor pattern layer and by the first insulating layer are lower than each of the intensities of the light reflected by the inclined and flat portions of the second thin film conductor pattern layer,
• (ii) detecting light reflected from the surface of the second thin film conductor pattern layer by optical detecting means including a transducer element for obtaining an optical image of the second thin film conductor pattern layer and providing a picture signal of the second thin film conductor pattern layer,
• (iii) comparing the picture signal of the second thin film conductor pattern layer with a reference picture signal corresponding to a standard second thin film conductor pattern layer so as to inspect for presence or absence of a fault in the second thin film conductor pattern and to determine a position of the fault upon inspection of a fault presence, and
• (iv) positioning the first thin film multilayer based on the determined position of the fault if present, and locally depositing of the fault if present, and locally depositing thin film conductor material to repair the fault, or irradiating an energy beam on the fault for removing material of the fault to repair the fault;
• and
• (c) subsequently, producing a second thin film multilayer substrate including
• (i) forming a second insulating layer having a second through-hole for electrical connection, on the repaired second thin film conductor pattern layer, and
• (ii) forming a third thin film conductor pattern layer on the second insulating layer and which is electrically connected with the second thin film conductor pattern layer through the second through-hole.

A method for producing a thin film multilayer substrate structure, comprising the steps of:

• (a) producing a first thin film multilayer substrate including
• (i) forming a first thin film conductor pattern layer on a substrate,
• (ii) forming a first insulating layer having a first through-hole for electrical connection on the first thin film conductor pattern layer, and
• (iii) forming a second thin film conductor pattern layer having a flat portion and an inclined portion, on the first insulating layer, and which is electrically connected with the first thin film conductor pattern layer through the first through-hole;
• (b) inspecting including
• (i) projecting an excitation light, capable of generating fluorescence from the first insulating layer, onto the first thin film multilayer substrate from a light projection means so as to effect scanning relative thereto in two directions,
• (ii) detecting fluorescence from the first insulating layer by optical detecting means including a transducer element for obtaining an optical image of the second thin film conductor pattern layer and providing a picture signal of the second thin film conductor pattern layer,
• (iii) comparing the picture signal of the second thin film conductor pattern layer with a reference picture signal corresponding to a standard second thin film conductor pattern layer to inspect for presence or absence of a fault in the second thin film conductor pattern and to determine a position of the fault upon inspection of a fault presence, and
• (iv) positioning the first thin film multi-layer substrate based on the determined position of the fault if present, and locally depositing thin film conductor material to repair the fault, or irradiating an energy beam on the fault for removing material of the fault to repair the fault;
• and
• (c) subsequently, producing a second thin film multilayer substrate including
• (i) forming a second insulating layer, having a second through-hole for electrical connection, on the repaired second thin film conductor pattern layer, and
• (ii) forming a third thin film conductor pattern layer on the second insulating layer and which is electrically connected with the second thin film wiring pattern layer through the second through-hole.