H05K 3/28
Applying non-metallic protective coatings
Official title: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
H05K3/28 (Applying non-metallic protective coatings) appears on 6,189 US grants and 6,417 published applications in this corpus.
Search patents in H05K- Granted patents
- 6,189
- Published applications
- 6,417
- Assignees
- 2,108
- Inventors
- 13,391
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 10 | 0 |
| 1978 | 19 | 0 |
| 1979 | 11 | 0 |
| 1980 | 15 | 0 |
| 1981 | 31 | 0 |
| 1982 | 15 | 0 |
| 1983 | 24 | 0 |
| 1984 | 23 | 0 |
| 1985 | 27 | 0 |
| 1986 | 32 | 0 |
| 1987 | 43 | 0 |
| 1988 | 48 | 0 |
| 1989 | 41 | 0 |
| 1990 | 63 | 0 |
| 1991 | 78 | 0 |
| 1992 | 81 | 0 |
| 1993 | 79 | 0 |
| 1994 | 95 | 0 |
| 1995 | 84 | 0 |
| 1996 | 70 | 0 |
| 1997 | 86 | 0 |
| 1998 | 131 | 0 |
| 1999 | 118 | 0 |
| 2000 | 91 | 0 |
| 2001 | 124 | 58 |
| 2002 | 135 | 162 |
| 2003 | 163 | 191 |
| 2004 | 171 | 229 |
| 2005 | 134 | 288 |
| 2006 | 135 | 282 |
| 2007 | 140 | 279 |
| 2008 | 152 | 323 |
| 2009 | 170 | 320 |
| 2010 | 183 | 297 |
| 2011 | 213 | 209 |
| 2012 | 222 | 202 |
| 2013 | 173 | 201 |
| 2014 | 162 | 252 |
| 2015 | 183 | 300 |
| 2016 | 201 | 238 |
| 2017 | 229 | 267 |
| 2018 | 230 | 296 |
| 2019 | 303 | 293 |
| 2020 | 283 | 334 |
| 2021 | 249 | 283 |
| 2022 | 209 | 253 |
| 2023 | 182 | 257 |
| 2024 | 202 | 237 |
| 2025 | 213 | 197 |
| 2026 | 99 | 169 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Biphasic material and stretchable circuit board6 Oct 2026US 12,757,321 B2Yale University
- Electronic device and manufacturing method thereof6 Oct 2026US 12,757,323 B2Innolux Corporation
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Package structure29 Sep 2026US 12,750,978 B2TMY Technology Inc.
- Module including metal member with protruding portion and method for manufacturing module29 Sep 2026US 12,750,992 B2Murata Manufacturing Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Circuit board assembly and method of manufacturing display using the same8 Oct 2026US 2026/0313812 A1Samsung Display Co., Ltd.
- Circuit board, and semiconductor package comprising same1 Oct 2026US 2026/0304621 A1LG Innotek Co., Ltd.
- Circuit board and manufacturing method of circuit board1 Oct 2026US 2026/0304639 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- Alumina insulation for coating implantable components and other microminiature devices490US 6,043,437 AAlfred E. Mann Foundation · 2000
- Method of applying insulation for coating implantable components and other microminiature devices464US 6,472,122 B1Medtronic MiniMed, Inc. · 2002
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997