H05K 3/281
By means of a preformed insulating foil
Official title: {by means of a preformed insulating foil (H05K3/284 takes precedence)}
H05K3/281 (By means of a preformed insulating foil) appears on 652 US grants and 578 published applications in this corpus.
Search patents in H05K- Granted patents
- 652
- Published applications
- 578
- Assignees
- 393
- Inventors
- 1,590
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 8 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 8 | 0 |
| 1987 | 10 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 13 | 0 |
| 1991 | 13 | 0 |
| 1992 | 14 | 0 |
| 1993 | 17 | 0 |
| 1994 | 15 | 0 |
| 1995 | 11 | 0 |
| 1996 | 9 | 0 |
| 1997 | 19 | 0 |
| 1998 | 36 | 0 |
| 1999 | 16 | 0 |
| 2000 | 17 | 0 |
| 2001 | 6 | 4 |
| 2002 | 12 | 16 |
| 2003 | 17 | 25 |
| 2004 | 16 | 15 |
| 2005 | 14 | 19 |
| 2006 | 11 | 33 |
| 2007 | 9 | 37 |
| 2008 | 12 | 32 |
| 2009 | 14 | 43 |
| 2010 | 26 | 31 |
| 2011 | 19 | 29 |
| 2012 | 15 | 25 |
| 2013 | 16 | 16 |
| 2014 | 18 | 25 |
| 2015 | 15 | 29 |
| 2016 | 19 | 25 |
| 2017 | 18 | 19 |
| 2018 | 10 | 14 |
| 2019 | 18 | 20 |
| 2020 | 18 | 18 |
| 2021 | 15 | 34 |
| 2022 | 21 | 24 |
| 2023 | 11 | 17 |
| 2024 | 21 | 14 |
| 2025 | 21 | 11 |
| 2026 | 6 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Flexible printed circuit board18 Aug 2026US 12,713,522 B2Lisa Dräxlmaier GmbH
- Method for manufacturing wiring board14 Jul 2026US 12,684,697 B2Fujikura Printed Circuits Ltd.
- Electronic equipment sealing structure and method for manufacturing the same24 Mar 2026US 12,588,153 B2Mektec Corporation
- Wiring circuit board assembly sheet and method for producing wiring circuit board assembly sheet20 Jan 2026US 12,532,417 B2Nitto Denko Corporation
- Roll-To-Roll Additive Manufacturing Method and Device11 Jun 2026US 2026/0164564 A1Trackonomy Systems, Inc.
- System and process for manufacturing flexible circuit board by laser cutting28 May 2026US 2026/0150198 A1Huaian M & T New Material Technology Co., Ltd
- Method for manufacturing wiring board, and wiring board9 Apr 2026US 2026/0101445 A1Fujikura Printed Circuits Ltd.
- Waterproof adhesive, preparation method of waterproof adhesive, and application method of waterproof adhesive28 Aug 2025US 2025/0270425 A1ASUSTeK COMPUTER INC.
- Flexible printed circuit board31 Jul 2025US 2025/0247951 A1Lisa Dräxlmaier GmbH
Most cited
By later US patents
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- Fabrication of discrete thin film wiring structures158US 5,224,265 AInternational Business Machines Corporation · 1993
- Damped magnetic head suspension assembly124US 4,819,094 A1989
- Liquid crystal display device assembled by flip chip technology comprising a folded multi-layered flexible driving circuit substrate120US 5,838,412 AHitachi Device Engineering Co., Ltd. · 1998
- Method of making an ultra high density pad array chip carrier119US 4,700,473 AMotorola, Inc. · 1987