System and process for manufacturing flexible circuit board by laser cutting

Abstract

A system and process for manufacturing a flexible circuit board by laser cutting are provided. The process includes the steps of: S1, loading and adding protective layers, introducing a copper foil base layer, and laminating the protective layers to upper and lower surfaces of the copper foil base layer, respectively, S2, performing laser cutting on a semi-finished product treated in S1 to form a circuit structure; S3, removing scraps from the semi-finished product treated in S2, performing activated cleaning on the surfaces of the copper foil, and performing pseudo-lamination hot-pressing for; S4, performing combinational hot-pressing on the semi-finished product treated in S3; S5, performing a windowing operation on the semi-finished product treated in S4; and S6, detecting and coding the semi-finished product treated in S5.

Dependencies are inferred from the claim text.