Method for manufacturing wiring board, and wiring board
AssigneeFujikura Printed Circuits Ltd.
InventorsDaisuke Arai, Shigeki Otsuka
Life of this patent
Estimating the term…
Abstract
A wiring board include: a base material; a wiring disposed on the base material; and a cover lay laminated on the base material and that covers the wiring. The cover lay includes an open portion exposing a part of the wiring, the cover lay includes a protection layer and an adhesive layer that adheres the protection layer to the base material, the cover lay has burrs that do not contact the base material at an edge portion of the cover lay along the open portion, an end face of the adhesive layer that faces the open portion contacts the wiring, and an end portion of the adhesive layer that constitutes the burrs is outside the end face of the adhesive layer.
Claims2
A wiring board comprising:
- a base material;
- a wiring disposed on the base material;
- and
- a cover lay laminated on the base material and that covers the wiring, wherein
- the cover lay includes an open portion exposing a part of the wiring,
- the cover lay includes a protection layer and an adhesive layer that adheres the protection layer to the base material,
- the cover lay has burrs that do not contact the base material at an edge portion of the cover lay along the open portion,
- an end face of the adhesive layer that faces the open portion contacts the wiring, and
- an end portion of the adhesive layer that constitutes the burrs is outside the end face of the adhesive layer.
Dependencies are inferred from the claim text.