Wiring circuit board assembly sheet and method for producing wiring circuit board assembly sheet
AssigneeNitto Denko Corporation
InventorNaoki Shibata
Life of this patent
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Abstract
An assembly sheet as a wiring circuit board assembly sheet includes a substrate, a wiring pattern, and a dummy wiring pattern. The substrate includes a product region and a frame region adjacent to the product region. The wiring pattern is located on one side in a thickness direction of the substrate in the product region, and includes a first wiring and a second wiring thicker than the first wiring. The dummy wiring pattern is located on the one side in the thickness direction in the frame region, and includes a first dummy wiring and a second dummy wiring thicker than the first dummy wiring.
Claims5
A wiring circuit board assembly sheet comprising:
- a substrate including a product region and a frame region adjacent to the product region;
- a base insulating layer located on one surface in a thickness direction of the substrate;
- a first wiring located on one surface in the thickness direction of the base insulating layer in the product region;
- a second wiring disposed together with the first wiring on the one surface in the thickness direction of the base insulating layer in the product region and being thicker than the first wiring;
- a first dummy wiring located on the one surface in the thickness direction of the base insulating layer in the frame region;
- and
- a second dummy wiring disposed together with the first dummy wiring on the one surface in the thickness direction of the base insulating layer in the frame region and being thicker than the first dummy wiring.
A method for producing a wiring circuit board assembly sheet comprising:
- a step of preparing a substrate including a product region and a frame region adjacent to the product region,
- a step of forming a first wiring on one side in a thickness direction of the substrate in the product region, while forming a first dummy wiring on the one side in the thickness direction in the frame region, and
- a step of forming a second wiring thicker than the first wiring on the one side in the thickness direction in the product region, while forming a second dummy wiring thicker than the first dummy wiring on the one side in the thickness direction in the frame region.
Dependencies are inferred from the claim text.