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US 12,684,697 B2Granted
Method for manufacturing wiring board
AssigneeFujikura Printed Circuits Ltd.
InventorsDaisuke Arai, Shigeki Otsuka
Life of this patent
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Abstract
A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material.
Claims4
A method of manufacturing a wiring board, the method comprising:
- (a) covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material;
- (b) covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material;
- and
- (c) removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material, wherein
- step (c) includes peeling the separation layer from the base material while pressing a portion of the cover lay other than the removal portion by a presser, and removing the removal portion by cutting a portion where the separation layer is not laminated on the cover lay.
2 more elements
Dependencies are inferred from the claim text.