Electronic equipment sealing structure and method for manufacturing the same
AssigneeMektec Corporation
InventorHirokazu Iwaki
Life of this patent
Estimating the term…
Abstract
Provided is an electronic equipment sealing structure that includes a case, a flexible printed circuit board, and an adhesive layer, in which the case includes a case body, an opening provided in the case body, and a pair of thin plate portions having flexibility; part of the flexible printed circuit board is inserted into the case body through the opening; one thin plate portion and the other thin plate portion of the pair of thin plate portions are provided along the opening so as to face each of first and second surfaces of the flexible printed circuit board; and the adhesive layer is provided so as to close a clearance between an inner wall surface of the opening and the flexible printed circuit board.
Claims8
An electronic equipment sealing structure comprising:
- a case;
- a flexible printed circuit board;
- and
- an adhesive layer,
- wherein the case includes a case body, an opening provided in the case body, and a pair of thin plate portions having flexibility,
- part of the flexible printed circuit board is inserted into the case body through the opening,
- one thin plate portion and the other thin plate portion of the pair of thin plate portions are provided along the opening so as to face first and second surfaces of the flexible printed circuit board, and
- the adhesive layer is provided so as to close a clearance between an inner wall surface of the opening and the flexible printed circuit board.
A method for manufacturing an electronic equipment sealing structure, comprising:
- providing an opening in a case;
- providing a pair of thin plate portions having flexibility along the opening such that one thin plate portion and the other thin plate portion of the pair of thin plate portions face each of first and second surfaces of a flexible printed circuit board to be inserted into the case through the opening;
- providing an adhesive layer on each of inner surfaces of the one thin plate portion and the other thin plate portion;
- inserting part of the flexible printed circuit board into the case through the opening;
- and
- performing adhering with the adhesive layer.
Dependencies are inferred from the claim text.