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US 2026/0313812 A1Published application
Circuit board assembly and method of manufacturing display using the same
AssigneeSamsung Display Co., Ltd.
InventorJoo Young PARK
Life of this patent
Estimating the term…
Abstract
A circuit board assembly includes a circuit board member, a first protection member disposed on at least a portion of an upper surface of the circuit board member, a first adhesive layer disposed between the circuit board member and the first protection member, and a support member disposed on a side of the first protection member and supporting at least a portion of a lower surface of the circuit board member.
Claims20
A circuit board assembly, comprising:
- a circuit board member;
- a first protection member disposed on at least a portion of an upper surface of the circuit board member;
- a first adhesive layer disposed between the circuit board member and the first protection member;
- and
- a support member disposed on a side of the first protection member and supporting at least a portion of a lower surface of the circuit board member.
2 more elements
A display device, comprising:
- a circuit board member;
- a first protection member disposed on at least a portion of an upper surface of the circuit board member;
- a first adhesive layer disposed between the circuit board member and the first protection member;
- and
- a support member disposed on a side of the first protection member and supporting at least a portion of a lower surface of the circuit board member.
2 more elements
A method of manufacturing a display, the method comprising:
- performing a support operation including arranging a first protection member on an upper surface of a circuit board member and supporting at least a portion of a lower surface of the circuit board member through a support member disposed on a side of the first protection member;
- and
- performing a transfer operation of transferring the circuit board member in a state in which a side of the circuit board member is supported by the support member.
Dependencies are inferred from the claim text.