H05K 3/284
For encapsulating mounted components
Official title: {for encapsulating mounted components (H05K1/185 takes precedence)}
H05K3/284 (For encapsulating mounted components) appears on 2,683 US grants and 2,991 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,683
- Published applications
- 2,991
- Assignees
- 1,132
- Inventors
- 6,071
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 8 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 11 | 0 |
| 1987 | 8 | 0 |
| 1988 | 11 | 0 |
| 1989 | 14 | 0 |
| 1990 | 12 | 0 |
| 1991 | 12 | 0 |
| 1992 | 22 | 0 |
| 1993 | 19 | 0 |
| 1994 | 24 | 0 |
| 1995 | 22 | 0 |
| 1996 | 20 | 0 |
| 1997 | 24 | 0 |
| 1998 | 37 | 0 |
| 1999 | 45 | 0 |
| 2000 | 37 | 0 |
| 2001 | 47 | 20 |
| 2002 | 36 | 64 |
| 2003 | 62 | 53 |
| 2004 | 59 | 101 |
| 2005 | 52 | 122 |
| 2006 | 64 | 122 |
| 2007 | 72 | 111 |
| 2008 | 59 | 124 |
| 2009 | 77 | 139 |
| 2010 | 79 | 138 |
| 2011 | 94 | 90 |
| 2012 | 105 | 90 |
| 2013 | 77 | 108 |
| 2014 | 79 | 123 |
| 2015 | 97 | 158 |
| 2016 | 95 | 108 |
| 2017 | 123 | 144 |
| 2018 | 135 | 151 |
| 2019 | 156 | 138 |
| 2020 | 151 | 173 |
| 2021 | 121 | 151 |
| 2022 | 112 | 129 |
| 2023 | 102 | 131 |
| 2024 | 117 | 115 |
| 2025 | 115 | 87 |
| 2026 | 49 | 101 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Biphasic material and stretchable circuit board6 Oct 2026US 12,757,321 B2Yale University
- Package structure29 Sep 2026US 12,750,978 B2TMY Technology Inc.
- Module including metal member with protruding portion and method for manufacturing module29 Sep 2026US 12,750,992 B2Murata Manufacturing Co., Ltd.
- Semiconductor device, power conversion device, and method of manufacturing semiconductor device8 Sep 2026US 12,733,103 B2Mitsubishi Electric Corporation
- Flexible circuit base board and flexible flat cable1 Sep 2026US 12,727,085 B2Avary Holding (Shenzhen) Co., Limited.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0312273 A1Amkor Technology Singapore Holding Pte.Ltd.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Module and electronic component10 Sep 2026US 2026/0271251 A1Murata Manufacturing Co., Ltd.
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Optical communication device using conformal coating layer as optical waveguide27 Aug 2026US 2026/0255474 A1LG Energy Solution, Ltd.
Most cited
By later US patents
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- Alumina insulation for coating implantable components and other microminiature devices490US 6,043,437 AAlfred E. Mann Foundation · 2000
- Method of applying insulation for coating implantable components and other microminiature devices464US 6,472,122 B1Medtronic MiniMed, Inc. · 2002
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- BGA component masking dam and a method of manufacturing with the BGA component masking dam353US 11,172,580 B2Rosemount Aerospace Inc. · 2021