Shielded electronic component assembly and method for making the same

A shielded electronic component assembly comprising:

• a wiring substrate having a plurality of signal members and a ground member;
• a semiconductor device mounted on the substrate and electrically coupled to the plurality of signal members;
• an insulative conformal coating formed over the semiconductor device and the plurality of signal members;
• a first conformal shielding layer formed over the insulating layer and electrically coupled to a first portion of the ground member, wherein the first conformal shielding layer comprises a polymer precursor material filled with particles selected to attenuate a first range of electromagnetic signal frequencies;
• and
• a second conformal shielding layer formed over the first conformal shielding layer and electrically coupled to the ground member, wherein the second conformal shielding layer comprises a polymer precursor material filled with particles selected to attenuate a second range of electromagnetic signal frequencies, wherein the first and second ranges of frequencies are at least partially exclusive.

A shielded electronic component assembly comprising:

• a semiconductor device to be shielded from a range of electromagnetic frequencies;
• a reference potential source;
• a housing enclosing the semiconductor device within the assembly, the housing having a plurality of interior surfaces;
• a conformal shielding layer formed on all interior surfaces of the housing and electrically connected to the reference potential source, the conformal shielding layer comprising:
• a first polymer precursor material;
• and
• a first plurality of filler particles of a first material within the precursor material which attenuate a first portion of the range of the electromagnetic frequencies;
• and
• a second plurality of filler particles of a second material within the precursor material which attenuate a second portion of the range of electromagnetic frequencies.

A method for shielding an electronic component from a range of electromagnetic frequencies comprising the steps of:

• providing a wiring substrate having a plurality of signal traces and at least one ground element formed on a surface thereof;
• providing an electronic component;
• mounting the electronic component to the wiring substrate such that the component is electrically coupled to the plurality of signal traces;
• depositing an insulative coating over the electronic component and the plurality of signal traces;
• providing a first shielding material, wherein the first shielding material comprises:
• a first precursor material;
• and
• a first plurality of filler particles selected to attenuate at least a first portion of the range of electromagnetic frequencies;
• and
• depositing the first shielding material on the insulative coating and over the electronic component such that the shielding layer is in electrical contact with the at least one ground element.