H05K 3/288
Removal of non-metallic coatings
Official title: {Removal of non-metallic coatings, e.g. for repairing}
H05K3/288 (Removal of non-metallic coatings) appears on 140 US grants and 124 published applications in this corpus.
Search patents in H05K- Granted patents
- 140
- Published applications
- 124
- Assignees
- 101
- Inventors
- 325
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 5 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 4 |
| 2002 | 5 | 2 |
| 2003 | 3 | 3 |
| 2004 | 4 | 3 |
| 2005 | 1 | 2 |
| 2006 | 2 | 5 |
| 2007 | 1 | 2 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 2 | 5 |
| 2011 | 2 | 3 |
| 2012 | 3 | 3 |
| 2013 | 2 | 1 |
| 2014 | 3 | 13 |
| 2015 | 4 | 10 |
| 2016 | 7 | 6 |
| 2017 | 11 | 11 |
| 2018 | 8 | 5 |
| 2019 | 7 | 6 |
| 2020 | 9 | 10 |
| 2021 | 7 | 3 |
| 2022 | 2 | 7 |
| 2023 | 5 | 1 |
| 2024 | 2 | 7 |
| 2025 | 2 | 4 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Method for manufacturing wiring board14 Jul 2026US 12,684,697 B2Fujikura Printed Circuits Ltd.
- Systems and methods for automated degassing during the manufacturing of a high speed design23 Jun 2026US 12,666,538 B2Advanced Micro Devices, Inc.
- Device and method for peeling off protective films from plate-shaped objects26 May 2026US 12,636,873 B2Advanced Engineering Industrie Automation GmbH
- Process method for laser removal of substrate solder mask16 Dec 2025US 12,501,555 B2Trillion Harvest Limited
- Component isolation during plasma exposure6 Aug 2026US 2026/0231340 A1Skyworks Solutions, Inc.
- Circuit board manufacturing device and circuit board manufacturing method30 Jul 2026US 2026/0223294 A1NHK Spring Co., Ltd.
- Method for manufacturing wiring board, and wiring board9 Apr 2026US 2026/0101445 A1Fujikura Printed Circuits Ltd.
- Techniques for manufacturing a wearable device5 Mar 2026US 2026/0064165 A1Oura Health Oy
- Method for manufacturing printed wiring board2 Oct 2025US 2025/0311113 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Photoreactive surface processing160US 5,669,979 AUVTech Systems, Inc. · 1997
- Photoreactive surface cleaning102US 5,814,156 AUVTech Systems, Inc. · 1998
- Method for printed circuit board and/or printed wiring board cleaning68US 4,640,719 APetroleum Fermentations N.V. · 1987
- Component rework60US 5,371,328 AInternational Business Machines Corporation · 1994
- Composition containing alcohol and use thereof for epoxy removal37US 4,294,729 AInternational Business Machines Corporation · 1981