Process method for laser removal of substrate solder mask

A method for laser removal of a substrate solder mask, the method comprising steps of:

• providing a substrate where a surface of said substrate comprises solder pads;
• covering the surface of said substrate and said solder pads with a solder mask, wherein a portion of said solder mask facing the surface of said substrate is a shielding portion and a portion of said solder mask facing said solder pads is a clearing portion;
• reading a QR-Code of a plate production part number on said substrate using at least one camera module;
• automatically importing CAD/CAM data to a laser device, said CAD/CAM data corresponding to said plate production part number;
• performing a stripping operation on said clearing portion according to said CAD/CAM data using a laser beam to cause
• said solder mask to comprise at least one hollow portion in said clearing portion according to said CAD/CAM data;
• taking at least a picture of said substrate through said at least one camera module to obtain a processed substrate picture;
• and
• comparing said processed substrate picture to said CAD/CAM data
• to determine if processing of said substrate is complete.