Circuit board manufacturing device and circuit board manufacturing method
AssigneeNHK Spring Co., Ltd.
InventorsShinya YANO, Ryosuke KOMATSU
Life of this patent
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Abstract
A circuit board manufacturing device that is a manufacturing device for a circuit board including a board, an insulation layer that is fixed on the board, and a circuit part that is formed from an electroconductive material and fixed on the insulation layer. The circuit board manufacturing device includes a first stripping unit. The first stripping unit is provided on a path for conveying the board in a state affixed with the insulation layer, and includes a suction part for suctioning a PET film and a nozzle for ejecting air between the insulation layer and the PET film.
Claims4
A circuit board manufacturing device for a circuit board comprising a board that is formed from a metal material, an insulation layer that is formed in a sheet shape from an insulating material and that is fixed on the board, and a circuit part that is formed from an electroconductive material and that is fixed on the insulation layer, the circuit board manufacturing device comprising:
- a stripping unit that is provided on a path for conveying the board in a state in which the insulation layer is affixed thereto, and that includes a suction part for suctioning a sheet shaped member affixed to the insulation layer and an ejection part for ejecting air between the insulation layer and the sheet shaped member.
Dependencies are inferred from the claim text.