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US 4,640,719 AGranted
Method for printed circuit board and/or printed wiring board cleaning
AssigneePetroleum Fermentations N.V.
InventorsMichael E. Hayes, Craig C. Hood, Ronald E. Miller, Robert Sharpe
Life of this patent
Estimating the term…
Abstract
Methods and compositions are provided for the removal of rosin soldering flux and adhesive tape residues from printed circuit and/or wiring boards, and for testing the quality of curing of U.V.-cured soldermask on such boards. The compositions of the invention contain terpene compounds, preferably in combination with terpene emulsifying surfactants to facilitate removal by rinsing in water.
Claims9
A method for removing rosin soldering flux or adhesive tape residues from a printed wiring board, comprising
- (a) contacting the board with a composition comprising a terpene compound and from 0 to about 40% by weight of a terpene emulsifying surfactant;
- (b) allowing the contact to continue for sufficient time to solubilize the soldering flux or tape residues;
- and
- (c) removing the composition and solubilized soldering flux or tape residues from the board
1 more element
Dependencies are inferred from the claim text.