H05K 3/24
Reinforcing of the conductive pattern
Official title: Reinforcing of the conductive pattern {(by solder coating H05K3/3465)}
H05K3/24 (Reinforcing of the conductive pattern) appears on 3,039 US grants and 2,749 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,039
- Published applications
- 2,749
- Assignees
- 1,121
- Inventors
- 6,541
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 18 | 0 |
| 1977 | 13 | 0 |
| 1978 | 19 | 0 |
| 1979 | 10 | 0 |
| 1980 | 19 | 0 |
| 1981 | 18 | 0 |
| 1982 | 23 | 0 |
| 1983 | 32 | 0 |
| 1984 | 39 | 0 |
| 1985 | 43 | 0 |
| 1986 | 33 | 0 |
| 1987 | 43 | 0 |
| 1988 | 43 | 0 |
| 1989 | 43 | 0 |
| 1990 | 42 | 0 |
| 1991 | 46 | 0 |
| 1992 | 33 | 0 |
| 1993 | 50 | 0 |
| 1994 | 45 | 0 |
| 1995 | 49 | 0 |
| 1996 | 51 | 0 |
| 1997 | 40 | 0 |
| 1998 | 62 | 0 |
| 1999 | 50 | 0 |
| 2000 | 68 | 0 |
| 2001 | 101 | 38 |
| 2002 | 103 | 100 |
| 2003 | 109 | 128 |
| 2004 | 103 | 161 |
| 2005 | 97 | 162 |
| 2006 | 92 | 179 |
| 2007 | 86 | 217 |
| 2008 | 119 | 183 |
| 2009 | 89 | 217 |
| 2010 | 94 | 186 |
| 2011 | 122 | 123 |
| 2012 | 152 | 97 |
| 2013 | 75 | 67 |
| 2014 | 78 | 94 |
| 2015 | 59 | 109 |
| 2016 | 74 | 69 |
| 2017 | 90 | 62 |
| 2018 | 53 | 61 |
| 2019 | 65 | 66 |
| 2020 | 61 | 84 |
| 2021 | 52 | 65 |
| 2022 | 64 | 70 |
| 2023 | 54 | 64 |
| 2024 | 47 | 65 |
| 2025 | 45 | 46 |
| 2026 | 23 | 36 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board and manufacturing method thereof1 Sep 2026US 12,727,078 B2Samsung Electro-Mechanics Co., Ltd.
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Apparatus and method of producing a sensing substrate4 Aug 2026US 12,698,024 B2Joyson Safety Systems Acquisition LLC
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board and manufacturing method of circuit board1 Oct 2026US 2026/0304639 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Means to improve the thermal performance of a printed electronics led light source13 Aug 2026US 2026/0239524 A1Signify Holding B. V.
- Method of manufacturing substrate having through-via30 Jul 2026US 2026/0223297 A1Korea Electronics Technology Institute
Most cited
By later US patents
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001
- Cobalt-tin alloys and their applications for devices, chip interconnections and packaging316US 5,755,859 AInternational Business Machines Corporation · 1998
- Method for fabricating printed circuits295US 5,235,139 AMacDermid, Incorprated · 1993