H05K 3/241
Characterised by the electroplating method
Official title: {characterised by the electroplating method; means therefor, e.g. baths or apparatus}
H05K3/241 (Characterised by the electroplating method) appears on 746 US grants and 585 published applications in this corpus.
Search patents in H05K- Granted patents
- 746
- Published applications
- 585
- Assignees
- 376
- Inventors
- 1,582
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 6 | 0 |
| 1980 | 6 | 0 |
| 1981 | 7 | 0 |
| 1982 | 8 | 0 |
| 1983 | 15 | 0 |
| 1984 | 13 | 0 |
| 1985 | 18 | 0 |
| 1986 | 8 | 0 |
| 1987 | 14 | 0 |
| 1988 | 10 | 0 |
| 1989 | 9 | 0 |
| 1990 | 19 | 0 |
| 1991 | 10 | 0 |
| 1992 | 6 | 0 |
| 1993 | 12 | 0 |
| 1994 | 11 | 0 |
| 1995 | 13 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 11 | 0 |
| 2000 | 15 | 0 |
| 2001 | 45 | 12 |
| 2002 | 26 | 21 |
| 2003 | 37 | 37 |
| 2004 | 17 | 37 |
| 2005 | 26 | 36 |
| 2006 | 25 | 38 |
| 2007 | 21 | 55 |
| 2008 | 30 | 41 |
| 2009 | 26 | 59 |
| 2010 | 23 | 25 |
| 2011 | 23 | 21 |
| 2012 | 32 | 16 |
| 2013 | 14 | 7 |
| 2014 | 12 | 14 |
| 2015 | 10 | 13 |
| 2016 | 6 | 16 |
| 2017 | 11 | 5 |
| 2018 | 5 | 16 |
| 2019 | 16 | 18 |
| 2020 | 18 | 15 |
| 2021 | 9 | 12 |
| 2022 | 16 | 20 |
| 2023 | 17 | 14 |
| 2024 | 8 | 16 |
| 2025 | 12 | 12 |
| 2026 | 3 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Printed circuit board and method for making the same30 Jun 2026US 12,672,232 B2Tong Hsing Electronic Industries, Ltd.
- Wiring circuit board10 Mar 2026US 12,575,028 B2Nitto Denko Corporation
- Wiring circuit board assembly sheet and method for producing wiring circuit board assembly sheet20 Jan 2026US 12,532,417 B2Nitto Denko Corporation
- Circuit board and manufacturing method thereof23 Dec 2025US 12,507,349 B2Samsung Electro-Mechanics Co., Ltd.
- Printed wiring board2 Dec 2025US 12,490,375 B2Sumitomo Electric Industries, Ltd.
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Method of manufacturing substrate having through-via30 Jul 2026US 2026/0223297 A1Korea Electronics Technology Institute
- Metallized ceramic circuit board and manufacturing method thereof23 Jul 2026US 2026/0214794 A1Tong Hsing Electronic Industries, Ltd.
- Circuit board and manufacturing method thereof23 Jul 2026US 2026/0214800 A1Samsung Electro-Mechanics Co., Ltd.
- Semiconductor package2 Jul 2026US 2026/0191054 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Copper electroplating apparatus146US 6,527,920 B1Novellus Systems, Inc. · 2003
- Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect137US 5,000,827 AMotorola, Inc. · 1991