Circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorYoungkyun Oh
Life of this patent
Estimating the term…
Abstract
A circuit board according to an embodiment includes: an insulating layer; a conductive pad disposed on the insulating layer, a plating lead-in wire that is disposed on the insulating layer and is connected to the conductive pad; and a solder resist layer that is disposed on the insulating layer and includes a first opening overlapping the conductive pad and a second opening spaced apart from the first opening. The plating lead-in wire extends from the conductive pad to one side wall of the second opening, and a second portion of the insulating layer overlapping the second opening is thinner than a first portion of the insulating layer overlapping the first opening.
Claims11
A circuit board comprising:
- an insulating layer;
- a conductive pad disposed on the insulating layer;
- a plating lead-in wire that is disposed on the insulating layer and is connected to the conductive pad;
- and
- a solder resist layer that is disposed on the insulating layer and includes a first opening overlapping the conductive pad and a second opening spaced apart from the first opening,
- wherein the plating lead-in wire extends from the conductive pad to one side wall of the second opening, and a first portion of the insulating layer overlapping the first opening is thicker than a second portion of the insulating layer overlapping the second opening.
A circuit board comprising:
- an insulating layer;
- a conductive pad disposed on the insulating layer;
- a plating lead-in wire that is disposed on the insulating layer and is connected to the conductive pad;
- and
- a solder resist layer that is disposed on the insulating layer and includes a first opening overlapping the conductive pad and a second opening spaced apart from the first opening,
- wherein the plating lead-in wire extends from the conductive pad to one side wall of the second opening, and the insulating layer has a step portion at the one side wall of the second opening.
Dependencies are inferred from the claim text.