Back to results
US 6,027,630 AGranted
Method for electrochemical fabrication
AssigneeUniversity of Southern California
InventorAdam L. Cohen
Life of this patent
Estimating the term…
Abstract
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Claims15
A method of electrically patterning an object, comprising:
- obtaining a supported mask which is separate from the object, having a first support portion, and a second patterned portion, said second patterned portion having a first surface connected to said first support portion, and a second surface which is conformable and can change in shape when pressed against said object to conform to a surface of said object;
- pressing said mask against said object in an electrically active bath;
- and
- after said pressing, passing a current through said electrically active bath, to pattern said object only at locations where said second patterned portion is not pressed against said object.
1 more element
Dependencies are inferred from the claim text.