H05K 3/242
Characterised by using temporary conductors on the printed circuit for electrically connecting
Official title: {characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated}
H05K3/242 (Characterised by using temporary conductors on the printed circuit for electrically connecting) appears on 281 US grants and 275 published applications in this corpus.
Search patents in H05K- Granted patents
- 281
- Published applications
- 275
- Assignees
- 165
- Inventors
- 666
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 9 | 3 |
| 2002 | 14 | 10 |
| 2003 | 13 | 17 |
| 2004 | 11 | 18 |
| 2005 | 12 | 22 |
| 2006 | 18 | 26 |
| 2007 | 13 | 31 |
| 2008 | 24 | 21 |
| 2009 | 12 | 28 |
| 2010 | 15 | 16 |
| 2011 | 14 | 12 |
| 2012 | 20 | 6 |
| 2013 | 6 | 6 |
| 2014 | 7 | 8 |
| 2015 | 8 | 2 |
| 2016 | 2 | 5 |
| 2017 | 1 | 2 |
| 2018 | 3 | 6 |
| 2019 | 3 | 3 |
| 2020 | 6 | 2 |
| 2021 | 1 | 3 |
| 2022 | 6 | 11 |
| 2023 | 4 | 4 |
| 2024 | 4 | 8 |
| 2025 | 7 | 3 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board10 Mar 2026US 12,575,028 B2Nitto Denko Corporation
- Wiring circuit board assembly sheet and method for producing wiring circuit board assembly sheet20 Jan 2026US 12,532,417 B2Nitto Denko Corporation
- Circuit board and manufacturing method thereof23 Dec 2025US 12,507,349 B2Samsung Electro-Mechanics Co., Ltd.
- Printed wiring board2 Dec 2025US 12,490,375 B2Sumitomo Electric Industries, Ltd.
- Electroplating edge connector pins of printed circuit boards without using tie bars25 Nov 2025US 12,484,156 B2NVIDIA Corporation
- Semiconductor package2 Jul 2026US 2026/0191054 A1Samsung Electronics Co., Ltd.
- Electroplating edge connector pins of printed circuit boards without using tie bars19 Mar 2026US 2026/0082490 A1NVIDIA Corporation
- Method for plating edge connectors on circuit board with gold, and circuit board5 Jun 2025US 2025/0185181 A1Suzhou Metabrain Intelligent Technology Co., Ltd.
- Printed circuit board, memory module including the same, and method of manufacturing printed circuit board15 May 2025US 2025/0159808 A1Samsung Electronics Co., Ltd.
- Patterned article including electrically conductive elements9 Jan 2025US 2025/0016916 A13M Innovative Properties Company
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Method of making a chip carrier package using laser ablation111US 6,660,559 B1Amkor Technology, Inc. · 2003
- Electronic part including a thin body of molding resin107US 5,729,437 ASeiko Epson Corporation · 1998
- Integrated circuit chip carrier87US 4,682,270 ABritish Telecommunications Public Ltd.Co. · 1987
- Electrolytic method of depositing gold connectors on a printed circuit board63US 5,733,466 AInternational Business Machines Corporation · 1998