Method for plating edge connectors on circuit board with gold, and circuit board

Abstract

The present application relates to the processing field of circuit boards. Disclosed are a method for plating edge connectors on a circuit board with gold, and a circuit board. The method comprises the following steps: filling gaps between edge connectors on a circuit board with a conductive medium, wherein the height of the conductive medium is greater than the height of each edge connector; enabling a tip of a first probe to be tangent to an upper surface of the conductive medium, and placing a tip of a second probe above the edge connector, wherein the tip of the second probe and the tip of the first probe are located in the same horizontal plane; connecting the first probe and the second probe to a loop on/off detection device; plating an upper surface of the edge connector with gold, and stopping gold plating when the loop on/off detection device detects the connection of a loop; and removing the conductive medium. In the present application, the gaps between the edge connectors are filled with the conductive medium, the height of which is greater than that of the edge connector, the tip of the first probe is tangent to the upper surface of the conductive medium, the tip of the second probe is flush with the tip of the first probe, and gold plating is stopped when each gold-plated layer comes into contact with the tip of the second probe, such that the gold-plated layers on all the edge connectors are equal in thickness; and there is no need to manufacture a lead wire.

Dependencies are inferred from the claim text.