Printed circuit board, memory module including the same, and method of manufacturing printed circuit board

A memory module comprising:

• a semiconductor chip;
• and
• a printed circuit board (PCB) comprising:
• a main body on which the semiconductor chip is provided;
• a first pin spaced apart from an edge of the main body by a first distance, the first pin comprising an end terminal to which a first signal is applied;
• and
• a second pin spaced apart from the edge of the main body by a second distance that is less than the first distance, the second pin comprising an end terminal to which a second supply voltage is applied, the second supply voltage having a level lower than a level of a first supply voltage corresponding to a power supply to the semiconductor chip.

A method of manufacturing a printed circuit board (PCB), the method comprising:

• forming an internal wiring layer on a plate layer;
• providing an insulating layer on the plate layer and the internal wiring layer;
• forming a contact hole penetrating the insulating layer;
• forming an external wiring layer on the insulating layer;
• forming a first pin, the first pin comprising:
• a first tab to which a signal is applied and a first tie-bar having a first length;
• forming a second pin, to form a resultant product, the second pin comprising:
• a second tab to which a ground voltage is applied and a second tie-bar having a second length that is greater than the first length, and
• separating the resultant product along a cutting line into the PCB having a first edge portion on which the first pin and the second pin are provided.