Method of making a chip carrier package using laser ablation
AssigneeAmkor Technology, Inc.
InventorsRonald P. Huemoeller, Richard P. Sheridan
Life of this patent
Estimating the term…
Abstract
A chip carrier package is made by using a laser-ablatable solder mask to cover areas of conductive traces on the surface of a substrate that were left uncovered during conventional processes using photoresist. These areas of the conductive traces are uncovered by using a laser to remove overlying portions of the solder mask. If a YAG laser is used, the conductive traces are removed at the same time the solder mask ablated. However, is a CO2 laser is used, a conventional etching process removes the exposed portions of the traces after the solder mask is ablated.
Claims16
A method for processing a substrate, comprising:
- providing a substrate having at least one conductive layer;
- forming a plurality of segments from the conductive layer, wherein a first plurality of the segments includes first portions for removal and second portions for plating;
- depositing a solder mask over the first portions;
- plating the second while the solder mask is overlying the first portions of the segments, and then removing at least portions of the solder mask overlying the first portions of the segments;
- and
- removing the first portions of the segments, wherein the removing of at least potions of the solder mask and the removing of the first portions of the segments is accomplished with a single laser use.
A method of processing a substrate, comprising:
- providing a multi-layer substrate having at least one conductive layer;
- patterning traces from the conductive layer;
- selecting a first portion from at least one of the traces, wherein the first portion is to be removed;
- depositing a laser-ablatable mask over the first portion;
- removing portions of the laser-ablatable mask overlying the first portion using a laser;
- and
- removing the first portion completely using said laser, wherein the removing of the portions of the laser-ablatable mask and the removing of the first portion is accomplished with a single laser use.
A method for manufacturing a substrate, comprising:
- providing a substrate having at least one conductive layer;
- patterning bond fingers and designed-in shorts from the conductive layer, wherein the designed-in shorts comprise portions for removal;
- depositing a solder mask over the portions of the designed-in shorts;
- plating the bond fingers while the portions of the designed-in shorts are covered by the solder mask;
- removing the solder mask overlying the portions of the designed-in shorts;
- and
- removing the portions of the designed-in shorts, wherein the removing of the solder mask and the removing of the portions of the designed-in shorts is accomplished with a single laser use.
A method for processing a substrate, comprising:
- providing a substrate having a plurality of metal traces, each said trace including a first portion and a second portion, wherein a thermal solder mask covers the first portion;
- plating at least part of the second portion of the traces while using the solder mask to avoid plating the first portion, and then removing the solder mask from the first portion of the traces using a laser;
- and
- removing the first portion of the traces, wherein the removing of the thermal solder mask and the underlying first portion of the traces is through a single laser operation.
Dependencies are inferred from the claim text.