Printed wiring board

A printed wiring board comprising:

• a base film having a first main surface and a second main surface opposite the first main surface;
• a wiring disposed on the first main surface and disposed on the second main surface;
• a first plating lead connected to a first position of the wiring;
• and
• a second plating lead connected to a second position of the wiring, wherein
• a cross sectional area of the wiring at a third position of the wiring is 95% or more of a cross sectional area of the wiring at the first position, the third position being an intermediate position between the first position and the second position,
• wherein the wiring has at least one coil formed by winding the wiring in a form of a spiral on the first main surface;
• wherein a through hole extends through the base film from the first main surface to the second main surface, wherein the wiring disposed on the first main surface is electrically connected to the wiring disposed on the second main surface by a conductor disposed on an inner wall surface of the through hole, wherein the through hole is located within the at least one coil;
• wherein
• the wiring has a seed layer disposed on the main surface, a first electroplating layer disposed on the seed layer, and a second electroplating layer covering the seed layer and the first electroplating layer, and
• a thickness of the second electroplating layer at the third position is 8 μm or less;
• wherein each of an end of the first plating lead opposite to the wiring and an end of the second plating lead opposite to the wiring reaches an end of the base film,
• wherein a first terminal is provided between the first plating lead and the first position of the wiring to connect the first plating lead to the first position of the wiring,
• wherein a second terminal is provided between the second plating lead and the second position of the wiring to connect the second plating lead to the second position of the wiring.