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US 12,575,028 B2Granted
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsDaigo Tsubai, Naoki Shibata, Hiroaki Machitani
Life of this patent
Estimating the term…
Abstract
A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.
Claims6
A wiring circuit board comprising:
- a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction,
- wherein the wiring circuit board has an edge portion extending in a first direction,
- wherein the edge portion includes a main structure portion in which the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction, and partially includes a partial structure portion in which the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction, and
- wherein the conductive layer includes:
- a lead wire remaining part-including terminal portion;
- and
- a wiring connected to the lead wire remaining part-including terminal portion, and wherein the lead wire remaining part-including terminal portion includes:
- a terminal portion connected to the wiring;
- and
- a lead wire remaining part which is disposed at an opposite side to the wire with respect to the terminal portion in the second direction, and disposed between the terminal portion and the insulating layer extension portion, and protrudes from the terminal portion toward the insulating layer extension portion.
7 more elements
A wiring circuit board comprising:
- a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction,
- wherein the wiring circuit board has an edge portion extending in a first direction,
- wherein the edge portion includes a main structure portion in which the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction, and partially includes a partial structure portion in which the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction,
- wherein the main structure portion includes a first main structure portion and a second main structure portion apart in the first direction,
- wherein, in the edge portion, the partial structure portion is located between the first main structure portion and the second main structure portion,
- wherein the edge portion includes a first boundary structure portion in which an end surface of the metal support substrate and an end surface of the insulating layer in the second direction are flush along the thickness direction, between the first main structure portion and the partial structure portion;
- and includes a second boundary structure portion in which the end surface of the metal support substrate and the end surface of the insulating layer in the second direction are flush along the thickness direction, between the second main structure portion and the partial structure portion, and
- wherein each end surface of the substrate extension portions of the first and second main structure portions, each end surface of the metal support substrate and the insulating layer of the first and second boundary structure portions, and an end surface of the insulating layer of the partial structure portion in the second direction are flush along the first direction.
5 more elements
A wiring circuit board comprising:
- a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction,
- wherein the wiring circuit board has an edge portion extending in a first direction,
- wherein the edge portion includes a main structure portion in which the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction, and partially includes a partial structure portion in which the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction,
- wherein the main structure portion includes a first main structure portion and a second main structure portion apart in the first direction,
- wherein, in the edge portion, the partial structure portion is located between the first main structure portion and the second main structure portion, and
- wherein each end surface of the insulating layers of the first and second main structure portions and an end surface of the insulating layer extension portion of the partial structure portion in the second direction are flush along the first direction.
3 more elements
A wiring circuit board comprising:
- a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction,
- wherein the wiring circuit board has an edge portion extending in a first direction,
- wherein the edge portion includes a main structure portion in which the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction, and partially includes a partial structure portion in which the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction,
- wherein the main structure portion includes a first main structure portion and a second main structure portion apart in the first direction,
- wherein, in the edge portion, the partial structure portion is located between the first main structure portion and the second main structure portion, and
- wherein each end surface of the substrate extension portions of the first and second main structure portions and an end surface of the metal support substrate of the partial structure portion in the second direction are flush along the first direction.
3 more elements
Dependencies are inferred from the claim text.