H05K 3/244

Finish plating of conductors, especially of copper conductors

Official title: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)}

H05K3/244 (Finish plating of conductors, especially of copper conductors) appears on 1,058 US grants and 1,066 published applications in this corpus.

Search patents in H05K

Granted patents: 1,058
Published applications: 1,066
Assignees: 497
Inventors: 2,660
Latest grant: 1 Sep 2026

Filings by year

H05K 3/244: granted patents and published applications per publication year
Year	Granted patents	Published applications
1976	2	0
1977	2	0
1978	5	0
1979	2	0
1980	6	0
1981	5	0
1982	3	0
1983	4	0
1984	8	0
1985	10	0
1986	7	0
1987	14	0
1988	7	0
1989	17	0
1990	8	0
1991	18	0
1992	9	0
1993	15	0
1994	15	0
1995	15	0
1996	19	0
1997	13	0
1998	21	0
1999	19	0
2000	27	0
2001	33	13
2002	35	33
2003	38	57
2004	44	58
2005	34	51
2006	35	64
2007	26	85
2008	39	70
2009	31	72
2010	36	67
2011	46	58
2012	45	43
2013	33	32
2014	34	34
2015	30	55
2016	27	21
2017	40	26
2018	20	19
2019	19	27
2020	26	38
2021	24	25
2022	24	25
2023	21	28
2024	19	28
2025	18	23
2026	10	14

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Recent patents

Most cited

By later US patents