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US 2026/0181771 A1Published application
Smart ic substrate, smart ic module, and ic card comprising same
AssigneeLG Innotek Co., Ltd.
InventorsJeong Min HYEON, Seung Joon KIM, Jung Hun OH
Life of this patent
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Abstract
A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite the first surface; and a circuit pattern disposed on at least one of the first surface and the second surface, wherein the circuit pattern includes a first metal layer and a second metal layer on the first metal layer, and wherein the second metal layer has an L* value of 83 to 87, an a* value of 12.0 to 13.5, and a b* value of 15 to 20 in a CIE L*a*b* color space.
Claims20
A smart IC substrate comprising:
- a substrate including a first surface and a second surface opposite the first surface;
- and
- a first circuit pattern disposed on the first surface of the substrate,
- wherein the first circuit pattern includes a first metal layer and a second metal layer on the first metal layer,
- wherein the second metal layer has an L* value of 83 to 87, an a* value of 12.0 to 13.5, and a b* value of 15 to 20 in a CIE L*a*b* color space,
- wherein the second metal layer includes a copper-gold (Cu—Au) alloy, and
- wherein a content of copper in the copper-gold (Cu—Au) alloy is 30 wt % or more.
4 more elements
A smart IC module comprising:
- a smart IC substrate and
- a chip attached on the smart IC substrate,
- wherein the smart IC substrate comprises:
- a substrate including a first surface and a second surface opposite the first surface;
- and
- a first circuit pattern disposed on the first surface of the substrate,
- wherein the first circuit pattern includes a first metal layer and a second metal layer on the first metal layer,
- wherein the second metal layer has an L* value of 83 to 87, an a* value of 12.0 to 13.5, and a b* value of 15 to 20 in a CIE L*a*b* color space,
- wherein the second metal layer includes a copper-gold (Cu—Au) alloy, and
- wherein a content of copper in the copper-gold (Cu—Au) alloy is 30 wt % or more.
7 more elements
A IC card comprising:
- a card body having an opening;
- and
- a smart IC module inserted and attached in the opening,
- wherein the smart IC module comprises:
- a smart IC substrate;
- and
- a chip attached on the smart IC substrate.
- wherein the smart IC substrate comprises:
- a substrate including a first surface and a second surface opposite the first surface;
- and
- a first circuit pattern disposed on the first surface of the substrate,
- wherein the first circuit pattern includes a first metal layer and a second metal layer on the first metal layer,
- wherein the second metal layer has an L* value of 83 to 87, an a* value of 12.0 to 13.5, and a b* value of 15 to 20 in a CIE L*a*b* color space,
- wherein the second metal layer includes a copper-gold (Cu—Au) alloy, and
- wherein a content of copper in the copper-gold (Cu—Au) alloy is 30 wt % or more.
12 more elements
Dependencies are inferred from the claim text.