H05K 3/243
Characterised by selective plating
Official title: {characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)}
H05K3/243 (Characterised by selective plating) appears on 614 US grants and 599 published applications in this corpus.
Search patents in H05K- Granted patents
- 614
- Published applications
- 599
- Assignees
- 294
- Inventors
- 1,449
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 4 | 0 |
| 1978 | 7 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 7 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 7 | 0 |
| 1986 | 7 | 0 |
| 1987 | 2 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 5 | 0 |
| 1991 | 10 | 0 |
| 1992 | 6 | 0 |
| 1993 | 9 | 0 |
| 1994 | 12 | 0 |
| 1995 | 11 | 0 |
| 1996 | 11 | 0 |
| 1997 | 8 | 0 |
| 1998 | 14 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 8 |
| 2002 | 24 | 15 |
| 2003 | 13 | 24 |
| 2004 | 22 | 47 |
| 2005 | 23 | 44 |
| 2006 | 22 | 57 |
| 2007 | 28 | 67 |
| 2008 | 39 | 60 |
| 2009 | 24 | 59 |
| 2010 | 24 | 41 |
| 2011 | 35 | 20 |
| 2012 | 44 | 20 |
| 2013 | 19 | 10 |
| 2014 | 12 | 20 |
| 2015 | 9 | 15 |
| 2016 | 11 | 11 |
| 2017 | 16 | 8 |
| 2018 | 10 | 9 |
| 2019 | 11 | 10 |
| 2020 | 10 | 8 |
| 2021 | 8 | 6 |
| 2022 | 6 | 11 |
| 2023 | 5 | 7 |
| 2024 | 7 | 11 |
| 2025 | 5 | 7 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Vertical power supply system and manufacturing method of connection board21 Apr 2026US 12,610,453 B2Delta Electronics (Shanghai) Co., Ltd.
- Method for forming flipped-conductor-patch24 Mar 2026US 12,588,145 B2Microchip Technology Caldicot Limited
- Wiring circuit board10 Mar 2026US 12,575,028 B2Nitto Denko Corporation
- Circuit board and manufacturing method thereof23 Dec 2025US 12,507,349 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board, fabrication method of the same and electronic device including the same9 Sep 2025US 12,414,230 B2Samsung Electronics Co., Ltd.
- Circuit board and manufacturing method of circuit board1 Oct 2026US 2026/0304639 A1Samsung Electro-Mechanics Co., Ltd.
- Packaging substrate and manufacture method for the same25 Jun 2026US 2026/0182419 A1Absolics Inc.
- Power supply module and electronic device16 Apr 2026US 2026/0107374 A1Delta Electronics (Shanghai) Co., Ltd.
- Vertical power supply system and manufacturing method of connection board12 Mar 2026US 2026/0075702 A1Delta Electronics (Shanghai) Co., Ltd.
- Wiring substrate2 Oct 2025US 2025/0311097 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994
- Double-sided hybrid high density circuit board and method of making same180US 5,072,075 ADigital Equipment Corporation · 1991
- Applying solder to high density substrates139US 5,316,788 AInternational Business Machines Corporation · 1994
- Method of making electronic module with multiple solder dams in soldermask window125US 5,798,285 AInternational Business Machines Corporation · 1998
- Wire interconnect structures for connecting an integrated circuit to a substrate112US 5,773,889 AFujitsu Limited · 1998