Wire interconnect structures for connecting an integrated circuit to a substrate

A wire interconnect structure comprising:

• an interconnect substrate having a first surface and a second surface;
• a first electrically conductive post disposed on said first surface for making contact to an interconnect pad, said post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted on the first surface and the top end for connecting to the pad by an electrically-conductive bonding material;
• a first layer formed on the body of said post extending in the direction of elongation from the bottom end of said post to a point intermediate between the bottom and top ends of said post, said first layer having a lower adherence to the bonding material than the exposed top portion of said post such that bonding material does not substantially adhere to the first layer when said post is connected to the pad;
• a second electrically conductive post disposed on the second surface of said interconnect substrate for making contact to another interconnect, said second post comprising an elongated body having a bottom end and top end thereof, the bottom end being mounted to the second surface of said interconnect substrate and the top end for connecting to the other interconnect pad by an electrically-conductive bonding material;
• and
• coupling means on said interconnect substrate for electrically coupling said first post to said second post.