Method for forming flipped-conductor-patch
AssigneeMicrochip Technology Caldicot Limited
InventorsJohn Adam Tracy deMercleden Smithells, Nina Biddle
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Abstract
A method includes providing a layer of non-conductive material having a conductive electroplating seed layer formed on a surface thereof; applying a photoresist layer over the surface of the conductive electroplating seed layer; and defining wiring channels in the photoresist resist layer. The method includes electroplating a conductive material in the defined wiring channels; adhering a non-conductive layer over the photoresist layer and the plated conductive material in the wiring channels; and removing the layer of non-conductive material and the conductive electroplating seed layer.
Claims19
A method comprising:
- providing a layer of non-conductive material having a conductive electroplating seed layer formed on a surface thereof;
- applying a photoresist layer over a top surface of the conductive electroplating seed layer;
- removing portions of the photoresist layer by masking, exposing and etching the photoresist layer so as to form wiring channels in the photoresist layer;
- electroplating a conductive material in the wiring channels;
- attaching a layer of one of polyester or polyimide over the photoresist layer and the electroplated conductive material using a layer of adhesive;
- and
- removing the layer of non-conductive material and the conductive electroplating seed layer by peeling off the layer of non-conductive material and the conductive electroplating seed layer;
- and
- after the removing the layer of non-conductive material and the conductive electroplating seed layer, cutting the layer of one of polyester or polyimide, the layer of adhesive, the photoresist layer and the electroplated conductive material into a plurality of patches.
A method comprising:
- providing a layer of non-conductive material having a conductive electroplating seed layer formed on a surface thereof;
- applying a photoresist layer over a top surface of the conductive electroplating seed layer;
- removing portions of the photoresist layer by masking, exposing and etching the photoresist layer so as to form wiring channels in the photoresist layer;
- electroplating a first layer of a first conductive material in the wiring channels;
- electroplating a second layer of a second conductive material over the first layer in the wiring channels;
- attaching a layer of one of polyester or polyimide over the photoresist layer and the electroplated second conductive material using a layer of adhesive;
- removing the layer of non-conductive material and the conductive electroplating seed layer by peeling off the layer of non-conductive material and the conductive electroplating seed layer;
- and
- after the removing the layer of non-conductive material and the conductive electroplating seed layer, cutting the layer of one of polyester or polyimide, the layer of adhesive, the photoresist layer and the electroplated first and second conductive material into a plurality of patches.
Dependencies are inferred from the claim text.