Printed circuit board, fabrication method of the same and electronic device including the same

A printed circuit board comprising:

• at least one insulation layer comprising a first rigid region and a flexible region extending from the first rigid region;
• at least one first circuit pattern disposed on a first surface of the at least one insulation layer to at least partially transverse the flexible region from the first rigid region;
• and
• at least one conductive pad at least partially disposed on a surface of the at least one first circuit pattern in the first rigid region,
• wherein a sum of thicknesses of the at least one conductive pad and the at least one first circuit pattern from the first surface of the at least one insulation layer in the first rigid region is 1.5 times to 4.0 times the thickness of the at least one first circuit pattern in the flexible region,
• wherein the at least one conductive pad comprises a plating layer at least partially grown on the surface of the at least one first circuit pattern,
• wherein the flexible region is configured to flexibly deform more than the first rigid region,
• wherein at least a portion of the at least one first circuit pattern comprises at least a portion of an electrically conductive film laminated on the first surface of the at least one insulation layer, and
• wherein the electrically conductive film includes a rolled copper foil and has higher durability regard to repeated deformation than a durability of the plating layer or an electrolytic copper foil.