H05K 3/245
Reinforcing conductive patterns made by printing techniques or by other techniques for
Official title: {Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques}
H05K3/245 (Reinforcing conductive patterns made by printing techniques or by other techniques for) appears on 684 US grants and 565 published applications in this corpus.
Search patents in H05K- Granted patents
- 684
- Published applications
- 565
- Assignees
- 382
- Inventors
- 1,614
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 8 | 0 |
| 1981 | 6 | 0 |
| 1982 | 10 | 0 |
| 1983 | 12 | 0 |
| 1984 | 15 | 0 |
| 1985 | 11 | 0 |
| 1986 | 12 | 0 |
| 1987 | 17 | 0 |
| 1988 | 15 | 0 |
| 1989 | 10 | 0 |
| 1990 | 10 | 0 |
| 1991 | 11 | 0 |
| 1992 | 13 | 0 |
| 1993 | 12 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 11 | 0 |
| 1997 | 13 | 0 |
| 1998 | 15 | 0 |
| 1999 | 13 | 0 |
| 2000 | 15 | 0 |
| 2001 | 17 | 4 |
| 2002 | 18 | 28 |
| 2003 | 22 | 14 |
| 2004 | 20 | 27 |
| 2005 | 18 | 43 |
| 2006 | 18 | 28 |
| 2007 | 14 | 32 |
| 2008 | 20 | 27 |
| 2009 | 11 | 37 |
| 2010 | 16 | 58 |
| 2011 | 24 | 23 |
| 2012 | 35 | 16 |
| 2013 | 11 | 15 |
| 2014 | 20 | 27 |
| 2015 | 12 | 28 |
| 2016 | 22 | 22 |
| 2017 | 27 | 16 |
| 2018 | 15 | 15 |
| 2019 | 17 | 16 |
| 2020 | 11 | 17 |
| 2021 | 14 | 28 |
| 2022 | 17 | 14 |
| 2023 | 9 | 8 |
| 2024 | 11 | 8 |
| 2025 | 7 | 8 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus and method of producing a sensing substrate4 Aug 2026US 12,698,024 B2Joyson Safety Systems Acquisition LLC
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Wiring board and method for manufacturing wiring board24 Mar 2026US 12,588,139 B2Fujikura Ltd.
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Transparent conductive circuit30 Sep 2025US 12,432,853 B2Chasm Advanced Materials, Inc.
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Means to improve the thermal performance of a printed electronics led light source13 Aug 2026US 2026/0239524 A1Signify Holding B. V.
- Methods for laser induced printing of electrodes with increased lifespan4 Jun 2026US 2026/0152859 A1Reophotonics, Ltd.
- Substrate for printed wiring board and printed wiring board14 May 2026US 2026/0136473 A1Sumitomo Electric Industries, Ltd.
- Transparent Conductive Circuit26 Feb 2026US 2026/0059660 A1Chasm Advanced Materials, Inc.
Most cited
By later US patents
- Electroless plating of nickel onto surfaces such as copper or fused tungston256US 5,147,692 AMacDermid, Incorporated · 1992
- Electrical conductivity-enhancing and protecting material247US 4,578,215 AMicro-Circuits Company · 1986
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986