H05K 3/246
Reinforcing conductive paste, ink or powder patterns by other methods
Official title: {Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating}
H05K3/246 (Reinforcing conductive paste, ink or powder patterns by other methods) appears on 309 US grants and 273 published applications in this corpus.
Search patents in H05K- Granted patents
- 309
- Published applications
- 273
- Assignees
- 203
- Inventors
- 792
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 6 | 0 |
| 1984 | 6 | 0 |
| 1985 | 5 | 0 |
| 1986 | 6 | 0 |
| 1987 | 7 | 0 |
| 1988 | 8 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 6 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 7 | 2 |
| 2002 | 8 | 13 |
| 2003 | 10 | 5 |
| 2004 | 11 | 12 |
| 2005 | 8 | 24 |
| 2006 | 11 | 10 |
| 2007 | 3 | 13 |
| 2008 | 7 | 9 |
| 2009 | 5 | 16 |
| 2010 | 5 | 25 |
| 2011 | 6 | 5 |
| 2012 | 13 | 6 |
| 2013 | 6 | 10 |
| 2014 | 9 | 17 |
| 2015 | 3 | 16 |
| 2016 | 16 | 15 |
| 2017 | 13 | 6 |
| 2018 | 9 | 9 |
| 2019 | 9 | 9 |
| 2020 | 6 | 11 |
| 2021 | 5 | 16 |
| 2022 | 10 | 8 |
| 2023 | 7 | 4 |
| 2024 | 6 | 3 |
| 2025 | 5 | 5 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method of producing a sensing substrate4 Aug 2026US 12,698,024 B2Joyson Safety Systems Acquisition LLC
- Transparent conductive circuit30 Sep 2025US 12,432,853 B2Chasm Advanced Materials, Inc.
- Patterned conductive article15 Jul 2025US 12,363,825 B23M Innovative Properties Company
- Electronic component and method for manufacturing electronic component24 Jun 2025US 12,342,471 B2Murata Manufacturing Co., Ltd.
- Liquid metal fusion with conductive inks and pastes17 Jun 2025US 12,336,115 B2Carnegie Mellon University
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Substrate for printed wiring board and printed wiring board14 May 2026US 2026/0136473 A1Sumitomo Electric Industries, Ltd.
- Transparent Conductive Circuit26 Feb 2026US 2026/0059660 A1Chasm Advanced Materials, Inc.
- Wiring board and method of manufacturing the same12 Feb 2026US 2026/0047002 A1
- Substrate for printed circuit board and printed circuit board27 Nov 2025US 2025/0365861 A1Sumitomo Electric Industries, Ltd.
Most cited
By later US patents
- Electroless plating of nickel onto surfaces such as copper or fused tungston256US 5,147,692 AMacDermid, Incorporated · 1992
- Manufacturing circuit board assemblies having filled vias171US 5,822,856 AInternational Business Machines Corporation · 1998
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986
- Method of making a through-hole connector92US 4,383,363 ASharp Kabushiki Kaisha · 1983
- Manufacturing method of a probe head for semiconductor LSI inspection apparatus89US 5,191,708 AHitachi, Ltd. · 1993