Method of making a through-hole connector

A method of making a through hole connector in an insulator circuit board substrate adapted to carry wiring patterns on both major surfaces thereof comprising the steps of:

• providing an insulator substrate;
• providing a reservoir of conductive paste adjacent said insulator substrate;
• forming first conductive bridge layers on both of the major surfaces of said insulator substrate in such a manner as to substantially completely cover both of said major surfaces of said insulator substrate;
• forming a through hole in said substrate and in said first conductive bridge layers by penetrating said insulator substrate and said first conductive bridge layers through the use of a penetrating means from the side of said substrate opposite said reservoir of conductive paste;
• continuing the penetration of said penetrating means through said formed through hole and dipping said penetrating means into said reservoir of conductive paste, and
• withdrawing said penetrating means from said reservoir and said through hole to thereby fill said through hole with conductive paste to form a through hole connector;
• forming second conductive bridge layers on substantially the entire surfaces of said first conductive bridge layers subsequent to the formation of said through hole and the deposition of said conductive paste therein in such a manner as to form substantially flat surfaces extending across substantially the entirety of each major surface of said substrate and across said through hole so that both end portions of said through hole connector are covered by said second conductive bridge layers and make direct contact with said first and second conductive bridge layers;
• and
• etching said first and second conductive bridge layers so as to form wiring patterns on both of the major surfaces of said insulator substrate electrically connected through said through hole connector.