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US 12,432,853 B2Granted
Transparent conductive circuit
AssigneeChasm Advanced Materials, Inc.
InventorsRichard P. Heroux, Timothy Alan Turner, David J. Arthur, Sean Patrick Arthur
Life of this patent
Estimating the term…
Abstract
A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.
Claims19
A transparent conductive film (TCF), comprising:
- a substrate having a surface;
- a metal mesh layer over at least a portion of the surface of the substrate, wherein the metal mesh layer comprises a network of interconnected metal traces with open spaces between the traces, wherein the metal mesh layer comprises at least 90% open spaces, and wherein the traces comprise two separate layers, one on top of the other;
- and
- a conductive layer over the metal mesh layer, the conductive layer comprising carbon nanotubes (CNT) and a binder, wherein a ratio of binder:CNT in the conductive layer is greater than 120:1.
1 more element
A method of producing a transparent conductive film (TCF), comprising:
- providing a substrate having a surface;
- depositing one of a metal mesh layer and a nanowire layer over at least a portion of the surface of the substrate, wherein the metal mesh layer comprises a network of interconnected metal traces with open spaces between the traces, wherein the traces or nanowires comprise two separate layers, one on top of the other, wherein the layers of the traces or nanowires are different metals;
- and
- patterning a conductive layer over at least some of the metal mesh layer or the nanowire layer, the conductive layer comprising carbon nanotubes (CNT) and a binder, wherein a ratio of binder:CNT in the conductive layer is greater than 120:1.
1 more element
A transparent conductive film (TCF), comprising:
- a substrate having a surface;
- a metal mesh layer over at least a portion of the surface of the substrate, wherein the metal mesh layer comprises a network of interconnected metal traces with open spaces between the traces, wherein the open spaces of the metal mesh layer have a width that is at least fifteen times the width of the metal traces, and wherein the traces comprise two separate layers, one on top of the other;
- and
- a conductive layer over the metal mesh layer, the conductive layer comprising carbon nanotubes (CNT) and a binder, wherein a ratio of binder:CNT in the conductive layer is greater than 120:1.
1 more element
Dependencies are inferred from the claim text.