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US 2026/0059660 A1Published application
Transparent Conductive Circuit
AssigneeChasm Advanced Materials, Inc.
InventorsRichard P. Heroux, Timothy Alan Turner, David J. Arthur, Sean Patrick Arthur
Life of this patent
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Abstract
A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.
Claims20
A transparent conductive film (TCF), comprising:
- a substrate having a surface;
- a metal mesh layer over at least a portion of the surface of the substrate, wherein the metal mesh layer comprises a network of interconnected metal traces with open spaces between the traces, wherein the metal mesh layer comprises at least 90% open spaces;
- and
- a conductive layer over the metal mesh layer, the conductive layer comprising carbon nanotubes (CNT) and a binder, wherein a ratio of binder:CNT in the conductive layer is at least 180:1.
1 more element
A method of producing a transparent conductive film (TCF), comprising:
- providing a substrate having a surface;
- depositing a metal mesh layer over at least a portion of the surface of the substrate, wherein the metal mesh layer comprises a network of interconnected metal traces with open spaces between the traces, wherein the metal mesh layer comprises at least 90% open spaces;
- and
- patterning a conductive layer over at least some of the metal mesh layer, the conductive layer comprising carbon nanotubes (CNT) and a binder, wherein a ratio of binder:CNT in the conductive layer is at least 180:1.
1 more element
Dependencies are inferred from the claim text.